Emkhakheni wokusika i-wafer ye-semiconductor, iphutha elingu-0.001mm lingenza ngisho ne-chip ingasebenzi. Isisekelo se-granite esibonakala singabalulekile, uma ikhwalithi yaso yehluleka ukuhlangabezana nezindinganiso, sisunduzela umkhiqizo wakho buthule onqenqemeni lwengozi enkulu kanye nezindleko eziphezulu! Lesi sihloko sikuyisa ngqo ezingozini ezifihliwe zezisekelo ezingaphansi kwezinga, sivikela ukunemba kokusika kanye nokusebenza kahle kokukhiqiza.
"Ibhomu elingabonakali" lezisekelo zegranite ezingaphansi kwezinga elifanele
1. Ukuguquguquka kokushisa okubalekayo: Umbulali obulalayo wokunemba
I-granite esezingeni eliphansi inomthamo omkhulu wokukhula kokushisa. Ngaphansi kwendawo yokushisa ephezulu yokusika i-wafer (kufika ku-150℃ kwezinye izindawo), ingase iguquke ibe ngu-0.05mm/m! Ngenxa yokuguquguquka kokushisa kwesisekelo esitshalweni esithile sokwenza i-wafer, ukuphambuka kosayizi wama-wafer asikiwe kudlule ku-±5μm, kanti izinga lokukhishwa kwe-single-batch lakhuphuka laya ku-18%.
2. Amandla okwakha anganele: Isikhathi senkonzo yemishini "sincishisiwe ngesigamu"
Izisekelo ezingafaneleki ezinobukhulu obungaphansi kuka-2600kg/m³ zinokwehla okungu-50% ekumelaneni nokuguguleka kanye nomthamo wokuthwala umthwalo ophawulwe ngokungafanele. Ngaphansi kokudlidliza okuvamile kokusika, ubuso besisekelo buvame ukuguguleka futhi kuvela imifantu emincane ngaphakathi. Ngenxa yalokho, imishini ethile yokusika yalahlwa eminyakeni emibili ngaphambi kwesikhathi esibekiwe, futhi izindleko zokuyishintsha zadlula isigidi esisodwa.
3. Ukungazinzi kahle kwamakhemikhali: Ukugqwala kugcwele ingozi
I-granite engahlangabezani nezindinganiso inokumelana nokugqwala okubuthakathaka. Izingxenye ze-asidi ne-alkali oketshezini lokusika zizoguguleka kancane kancane isisekelo, okuholela ekuwohlokeni kokusicaba. Imininingwane evela elabhorethri ethile ikhombisa ukuthi ngokusebenzisa izisekelo eziphansi, umjikelezo wokulinganisa imishini ufinyeziwe kusukela ezinyangeni eziyisithupha kuya ezinyangeni ezimbili, futhi izindleko zokulungisa zikhuphuke kathathu.
Ungazibona kanjani izingozi? Amaphuzu Amane Okuhlola Okumele Uwafunde!
✅ Ukuhlolwa kobuningi: Ubuningi begranite obusezingeni eliphezulu ≥2800kg/m³, kungaba khona isici se-porosity esingaphansi kwaleli nani;
✅ Ukuhlolwa kokunwetshwa kwe-coefficient yokushisa: Cela umbiko wokuhlolwa ongu-< 8×10⁻⁶/℃, akukho "inkosi yokuguquguquka kokushisa okuphezulu";
✅ Ukuqinisekiswa kokuthamba: Uma kulinganiswa nge-laser interferometer, ukuthamba kufanele kube ≤±0.5μm/m, ngaphandle kwalokho ukugxila kokusika kuthambekele ekushintsheni;
✅ Ukuqinisekiswa kwesitifiketi esigunyaziwe: Qinisekisa i-ISO 9001, i-CNAS kanye nezinye izitifiketi, wenqabe isisekelo esithi "akukho okuthathu".
Ukunemba kokuvikela kuqala kusukela esisekelweni!
Ukusikwa ngakunye kwe-wafer kubalulekile empumelelweni noma ekwehlulekeni kwe-chip. Ungavumeli izisekelo ze-granite ezingaphansi kwezinga zibe "isikhubekiso" sokunemba! Chofoza ukuze uthole "Incwadi Yokuhlola Ikhwalithi Yesisekelo Se-Wafer Cutting", thola ngokushesha izingozi zemishini, bese uvula izixazululo zokukhiqiza ezinembe kakhulu!
Isikhathi sokuthunyelwe: Juni-13-2025