Kungani Kusetshenziswa I-Precision Granite Kumishini Ye-Semiconductor, CMM kanye Nezinhlelo Ze-Laser

Hamba embonini yemishini yokunemba bese uqhubeka nokuhlangana netshe elimpunga elifanayo. Isisekelo sesistimu yokuhlola i-wafer, ibhuloho lomshini wokulinganisa oqondile, isigaba se-XY somsiki we-laser we-femtosecond - konke kwenziwa nge-granite enembile. Lokhu akuyona isiko noma imfashini; ubunjiniyela bezinto zokwakha. Leli khasi le-hub lihlanganisa izinhlelo zokusebenza ezintathu ezidinga kakhulu ohlakeni olulula -Isicelo → Isidingo Sobunjiniyela → Ingxenye Yegranite → Kungani Igranite— ukuze onjiniyela be-OEM bakwazi ukuthola ngokushesha isizathu (kanye nengxenye) esihlobene nomshini wabo.

Imishini Ye-semiconductor

Izingxenye ezijwayelekile:isisekelo segranite, i-gantry yegranite, ikholomu yegranite, isiteji segranite.

Izidingo zobunjiniyela:ukuzinza kokushisa + ukudambisa ukudlidliza + ukuzinza kwejometri.

Ipulatifomu yokuhlola noma i-semiconductor metrology ingase ibambe ukulungelelaniswa kwe-sub-micron ngaphezu kwemitha yokuhamba kuyilapho ama-linear motors, izilawuli zemvelo kanye nabaqhubi bonke befaka ukushisa nokudlidliza.isisekelo se-granite se-semiconductoryisakhiwo esingasebenzi esenza isinxephezelo esisebenzayo sisebenze kalula: nge-coefficient yokwandisa ukushisa ezungeze u-5–6 × 10⁻⁶/°C kanye nokumanzisa kwangaphakathi cishe ngokuphindwe kayishumi kunensimbi, i-granite igcina i-geometry ye-datum yomshini ingaguquguquki ngenkathi i-elekthronikhi iphatha amaphutha amancane asheshayo.ama-gantrieshlanganisa imigqa emibili kanye nogongolo oluphambeneyo esakhiweni esisodwa esigoqekile, ngakho-ke ukwakheka kwe-orthogonality kwenziwa nge-granite esikhundleni sokulungiswa;amakholomubaphatha ama-Z-stack anokuqina okuphezulu futhi awanawo amandla okubangela ukuphazamiseka kwama-motor noma ama-sensor; i-graniteizigabainikeza izindiza zokubhekisela eziqinile, ezingaboli zama-air bearings kanye nama-wedge mounts. Ukuhambisana negumbi lokuhlanza kuyinzuzo eyengeziwe ethule: itshe aligqwali, alidingi ifilimu kawoyela, futhi lidlula igesi kancane kakhulu kunensimbi emboziwe.

Imishini Yokulinganisa Ehlanganisiwe (i-CMM)

Izingxenye ezijwayelekile:itafula legranite, ibhuloho legranite, imigwaqo yegranite.

Izidingo zobunjiniyela:ireferensi yokulinganisa + ukuzinza kobukhulu.

I-CMM, empeleni, iwuhlelo lokuxhumanisa olubonakalayo.Isisekelo se-granite se-CMM isi-datum: ubuso bayo obugobile buchaza u-Z, futhi ukuba yisicaba kwayo (ngokuvamile okungu-≤ 3–5 µm ngaphezu kwamamitha amabili, futhi kufinyelele ebangeni le-sub-micron yemishini yelebhu) kungena ngqo kuyo yonke imiphumela yokulinganisa.ibhuloho le-granitekumele ihambe ngokuphindaphindiwe ngaphandle kokujika, okuyinto engayenza ngoba ubude bayo abuhambi ngokushisa okuma ngendlela insimbi ebingenza ngayo — ukuphindaphindeka okulinganiswe namuhla ekuseni kusasebenza nanamuhla ntambama.imigwaqo kanye nemishayoyamukela ama-pads anomoya othwala noma ashelelayo ezindaweni eziyisicaba neziqinile (Mohs ~ 6-7) ezimelana nokuguguleka nokuklwebheka eminyakeni eminingi yokusebenza. Ngenxa yokuthi i-granite ayinawo ukucindezeleka komshini osele, i-CMM elinganisiwe ngemva kokufakwa ihlala ilinganisiwe — ukuzinza kobukhulu besikhathi eside yilokho kanye okudingwa “ireferensi yokulinganisa”. Kubakhiqizi abakhetha ipulatifomu, umhlahlandlela wethu wokukhethaisisekelo se-granite semishini yokunembaihlanganisa ubukhulu kanye nokukhethwa kwebanga ngokujulile.

Imishini ye-Laser

Izingxenye ezijwayelekile:isisekelo segranite, isigaba segranite XY, izingxenye zesakhiwo segranite.

Izidingo zobunjiniyela:ukulawula ukudlidliza + ukuzinza kokushisa.

Ukucubungula nge-laser kuyimpi yokulwa nezitha ezimbili: ukudlidliza nokushisa. Ukukhomba imisebe, indawo yokugxila kanye nekhwalithi yokusika kuphendula ekuphambukeni kwendlela engaphansi kwe-micron, ngakho-keisisekelo se-granite somshini we-laserkumele ihlukanise indlela yokukhanya ekudlidlizeni phansi nasekunyakazeni komshini. Ukuminyana okuphezulu kwangaphakathi kwe-granite kubola ukudlidliza okubangelwa yisigaba ngokushesha, kulola imiphetho ekusetshenzisweni okuncane futhi kuqinise ububanzi be-kerf ekusikeni. Ukwanda kwayo okuphansi, okulinganayo kokushisa kugcina indlela ye-beam iqondane njengoba umthombo we-laser kanye nendawo ezungezile kufudumala. I-graniteIsigaba se-XYihlinzeka nge-substrate eyisicaba, eqinile, engeyona ene-magnetic lapho ama-motor aqondile nama-air bearings kushelela khona — akukho ukudonswa kwemfucumfucu okune-magnetic ku-bearing gap, akukho ukugqwala okuvela ku-assist-gas condensate. Kuzinhlelo ze-femtosecond kanye ne-picosecond, lapho ifasitela lenqubo lilinganiswa ngama-nanometer, izingxenye zesakhiwo se-granite ziwubuchwepheshe obuvumelayo kunokuba kube yinto ekhethwayo.

Isifinyezo Sokusetshenziswa Okuphambene

Umbuzo Wokuhlinzeka Ngezinto Ezithile, Izimboni Ezintathu - kanye Nombuzo Wokuphakelwa Okukodwa

Amagama angukhiye anomsila omude angenhla —izingxenye zegranite ze-semiconductor, izingxenye zegranite ze-CMM, isisekelo segranite semishini yokunemba, isiteji segranite, i-gantry yegranite— konke kuncipha kube yingqikithi efanayo yobunjiniyela: into engashukumi, engagqwali, engangenisi ugesi futhi engakhali, eyakhiwe yaba yizakhiwo zedatha yomshini. Okuhlukanisa abahlinzeki akuyona itshe kodwa imvilophu yokukhiqiza kanye nesiyalo sokuhlola ngemuva kwalo: ukukhethwa kwamabhulokhi, imishini engenangcindezi, ukugaya ngefomethi enkulu, kanye nokulinganisa okunokungabaza okubhaliwe.

I-ZHHIMG®inikeza izisekelo ze-granite ezinembile, ama-gantries, amakholomu, amabhuloho kanye nezigaba zabakhiqizi bemishini ye-semiconductor, i-CMM kanye ne-laser emhlabeni wonke — ezisebenza njengezingxenye ezilodwa ezifika ku-100 t kanye no-20 m, zigaywe emishinini emikhulu kuze kufike ku-6000 mm.Sitshele ngesicelo sakhofuthi sizophakamisa i-geometry yezingxenye, ibanga kanye nohlelo lokufaka ukuze luhambisane nesabelomali sakho samaphutha.