Emkhakheni wokusika i-wafer ye-semiconductor, iphutha elingu-0.001mm lingenza i-chip ingasebenzi. Isisekelo se-granite esibonakala singabalulekile, lapho izinga layo lehluleka ukuhlangabezana nezindinganiso, iphusha buthule umkhiqizo wakho onqenqemeni lwengozi enkulu kanye nezindleko eziphezulu! Lesi sihloko sikuyisa ngokuqondile ezingozini ezifihliwe zezisekelo ezisezingeni eliphansi, ukuvikela ukunemba kokusika nokusebenza kahle kokukhiqiza.
"Ibhomu elingabonakali" lezisekelo ze-granite ezingekho ezingeni
1. I-Runaway thermal deformation: Umbulali obulalayo wokunemba
I-granite yekhwalithi ephansi ine-coefficient eyeqile yokunweba okushisayo. Ngaphansi kwezinga lokushisa eliphezulu lokusikwa kwe-wafer (kufika ku-150 ℃ kwezinye izindawo), ingase ibe nokuguqulwa okungu-0.05mm/m! Ngenxa yokushisa okushisayo kwesisekelo esitshalweni esithile sokwenziwa kwama-wafer, ukuchezuka kosayizi wamawafa asikiwe kudlule ku-±5μm, futhi izinga le-single-batch scrap likhuphuke lafika ku-18%.
2. Amandla esakhiwo anganele: Impilo yesevisi yemishini "ihhafu"
Izisekelo ezingafanelekile ezinokuminyana okungaphansi kuka-2600kg/m³ zinokuncishiswa okungama-50% kokumelana nokugqokwa kanye namandla okuthwala amanga. Ngaphansi kokudlidliza okusika njalo, ingaphezulu lesisekelo lijwayele ukugqoka futhi ama-micro-cracks avela ngaphakathi. Ngenxa yalokho, umshini othile wokusika wachithwa kusasele iminyaka emibili, futhi izindleko zokushintshwa zadlula esigidini esisodwa.
3. Ukungaqini kahle kwamakhemikhali: Ukugqwala kugcwele ingozi
I-Granite engahlangabezani nezindinganiso inokumelana nokugqwala okubuthakathaka. Izingxenye ze-asidi ne-alkali oketshezini olusikayo zizoguguleka kancane kancane isisekelo, okuholela ekuwohlokeni kokucaba. Idatha evela kulabhorethri ethile ibonisa ukuthi ngokusebenzisa izisekelo eziphansi, umjikelezo wokulinganisa imishini ufinyezwe kusukela ezinyangeni eziyisithupha kuya ezinyangeni ezimbili, futhi izindleko zokunakekela zikhuphuke ngokuphindwe kathathu.
Indlela yokubona izingozi? Amaphuzu Amane Abalulekile Wokuhlola Okufanele Uwafunde!
✅ Ukuhlolwa kokuminyana: Ukuminyana kwegranite kwekhwalithi ephezulu ≥2800kg/m³, ngaphansi kwalokhu kukhubazeka kwevelu kungase kube khona;
✅ I-coefficient yokuhlolwa kokunwetshwa kwe-thermal: Cela umbiko wokuhlola we-< 8×10⁻⁶/℃, akukho "inkosi yokushintsha izinga lokushisa eliphezulu";
✅ Ukuqinisekiswa kwe-flatness: Kukalwa nge-laser interferometer, flatness kufanele kube ≤±0.5μm/m, ngaphandle kwalokho ukugxila kokusika kujwayele ukushintsha;
✅ Ukuqinisekiswa okugunyaziwe kwesitifiketi: Qinisekisa i-ISO 9001, i-CNAS nezinye izitifiketi, wenqaba isisekelo "sathathu-cha".
Ukunemba kokuqapha kuqala kusuka kusisekelo!
Konke ukusikwa kwe-wafer kubalulekile empumelelweni noma ekuhlulekeni kwe-chip. Ungavumeli izisekelo zegwadle ezisezingeni eliphansi zibe "yisikhubekiso" ngokunemba! Chofoza ukuze uthole "I-Wafer Cutting Base Assessment Manual", khomba ngokushesha izingozi zemishini, futhi uvule izixazululo zokukhiqiza ezinembayo eziphezulu!
Isikhathi sokuthumela: Jun-13-2025