Susa ukubethela "i-rock force" ngemuva kokukhiqizwa kwe-semiconductor - Izingxenye zokunemba ze-granite zingawubumba kanjani kabusha umngcele onembayo wokukhiqiza ama-chip

I-Precision Revolution ekukhiqizeni i-semiconductor: Lapho i-granite ihlangana nobuchwepheshe be-micron
1.1 Okutholwe okungalindelekile kusayensi yezinto
Ngokombiko we-2023 SEMI International Semiconductor Association, u-63% wezindwangu ezithuthukisiwe emhlabeni seziqalile ukusebenzisa izisekelo ze-granite esikhundleni sezinkundla zensimbi zendabuko. Leli tshe lemvelo, elisuka ku-magma condensation ekujuleni koMhlaba, libhala kabusha umlando wokwenziwa kwe-semiconductor ngenxa yezakhiwo zalo ezibonakalayo eziyingqayizivele:

Inzuzo ye-thermal inertia: i-thermal expansion coefficient ye-granite 4.5×10⁻⁶/℃ ingu-1/5 kuphela waleyo yensimbi engagqwali, futhi ukuzinza kwe-dimensional okungu-±0.001mm kugcinwa emsebenzini oqhubekayo womshini we-lithography.

Izici zokudambisa ukudlidliza: i-coefficient yangaphakathi yokungqubuzana iphakeme ngokuphindwe izikhathi eziyi-15 kune-cast iron, imunca ngempumelelo i-micro-vibration

Imvelo ye-Zero magnetization: susa ngokuphelele iphutha kazibuthe esilinganisweni se-laser

1.2 Uhambo lwe-metamorphosis ukusuka kweyami ukuya entweni
Sithatha isizinda sokukhiqiza esihlakaniphile se-ZHHIMG eShandong njengesibonelo, ucezu lwegwadle eluhlaza ludinga ukudlula:

Ukwenza imishini enembayo kakhulu: isikhungo semishini esinama-axis amahlanu amahora angu-200 okugaya okuqhubekayo, ukuhwashala phezulu kufika ku-Ra0.008μm

Ukwelashwa kokuguga okwenziwa ngamahora angu-48: amahora angu-48 okukhululwa kokucindezeleka kwemvelo endaweni yokusebenzela yokushisa nomswakama njalo, okuthuthukisa ukuzinza komkhiqizo ngo-40%
Okwesibili, qeda izinkinga eziyisithupha zokunemba kokukhiqizwa kwe-semiconductor "isixazululo sedwala"
2.1 Uhlelo lokunciphisa izinga lokuhlukaniswa kwe-wafer

Ukuboniswa kwecala: Ngemuva kokuthi i-chip Foundry eJalimane ithatha inkundla yethu yegwadle entantayo:

Ububanzi be-wafer	ukunciphisa izinga le-chip	ngcono flatness
12 amayintshi	67%	≤0.001mm
18 amayintshi	82%	≤0.0005mm

2.2 Uhlelo lokunemba lokunemba kwe-lithographic

Uhlelo lwesinxephezelo sezinga lokushisa: inzwa eshumekiwe ye-ceramic iqapha ukuguquguquka komumo ngesikhathi sangempela futhi ilungisa ngokuzenzakalelayo ukuthambekela kweplatifomu.
Idatha elinganisiwe: ngaphansi kokuguquguquka okungu-28℃±5℃, ukunemba kokushumeka kushintshashintsha ngaphansi kuka-0.12μm