Susa ukubhala phansi “amandla edwala” ngemuva kokukhiqizwa kwe-semiconductor – Izingxenye zokunemba kwe-granite zingawubumba kanjani kabusha umngcele wokunemba wokukhiqizwa kwe-chip

I-Precision Revolution ekukhiqizweni kwe-semiconductor: Lapho i-granite ihlangana nobuchwepheshe be-micron
1.1 Ukutholwa okungalindelekile kwisayensi yezinto ezibonakalayo
Ngokusho kombiko we-SEMI International Semiconductor Association ka-2023, ama-63% ezinto ezisezingeni eliphezulu emhlabeni aseqalile ukusebenzisa izisekelo ze-granite esikhundleni samapulatifomu ensimbi endabuko. Leli tshe lemvelo, elivela ekujikeni kwe-magma ekujuleni koMhlaba, libhala kabusha umlando wokukhiqizwa kwe-semiconductor ngenxa yezakhiwo zalo eziyingqayizivele zomzimba:

Inzuzo ye-Thermal inertia: i-coefficient yokwanda kokushisa kwe-granite engu-4.5×10⁻⁶/℃ iyi-1/5 kuphela yensimbi engagqwali, futhi ukuzinza kobukhulu obungu-±0.001mm kugcinwa emsebenzini oqhubekayo womshini we-lithography.

Izici zokunciphisa ukudlidliza: i-coefficient yangaphakathi yokungqubuzana iphakeme ngokuphindwe ka-15 kuneyensimbi ephonswe, imunca ngempumelelo imishini yokudlidliza okuncane

Imvelo ye-Zero magnetization: susa ngokuphelele iphutha le-magnetic ekulinganisweni kwe-laser

1.2 Uhambo lokuguquka kwesimo kusukela kokwami ​​kuya kokuhle kakhulu
Uma sibheka isisekelo sokukhiqiza esihlakaniphile se-ZHHIMG eShandong njengesibonelo, ucezu lwe-granite eluhlaza ludinga ukudlula:

Umshini wokugaya oqondile kakhulu: isikhungo sokugaya esinama-axis amahlanu amahora angama-200 okugaya okuqhubekayo, ubulukhuni bomphezulu obufika ku-Ra0.008μm

Ukwelashwa kokuguga okwenziwe: Amahora angu-48 okukhululwa kokucindezeleka kwemvelo endaweni yokushisa nomswakama engaguquki, okuthuthukisa ukuzinza komkhiqizo ngo-40%
Okwesibili, qeda izinkinga eziyisithupha zokunemba kokukhiqiza "isixazululo sedwala" se-semiconductor
2.1 Uhlelo lokunciphisa izinga lokuqhekeka kwe-wafer

Ukuboniswa kwecala: Ngemva kokuba imboni yokusungula ama-chip eJalimane isebenzise ipulatifomu yethu ye-granite entantayo yegesi:

Ububanzi be-Wafer	ukunciphisa izinga le-chip	ukuthuthukiswa kokuthamba
Amasentimitha angu-12	67%	≤0.001mm
Amasentimitha angu-18	82%	≤0.0005mm

2.2 Uhlelo lokuphumelela kokunemba kokuqondanisa kwe-Lithographic

Uhlelo lokunciphisa izinga lokushisa: inzwa yobumba ehlanganisiwe iqapha ukuguquguquka kwesimo ngesikhathi sangempela futhi ilungisa ngokuzenzakalelayo ukuthambekela kwepulatifomu
Idatha elinganisiwe: ngaphansi kokuguquguquka okungu-28℃±5℃, ukunemba kokushumeka kuyashintshashintsha ngaphansi kuka-0.12μm