Emkhakheni wemishini yokucubungula ngokunemba, ikhwalithi ye-laser bonding yezisekelo ze-granite ithinta ngokuqondile ukuzinza kwemishini. Kodwa-ke, amabhizinisi amaningi awele enkingeni yokwehla kokunemba nokugcinwa njalo ngenxa yokunganaki imininingwane ebalulekile. Lesi sihloko sihlanza ngokujulile izingozi zekhwalithi ukuze sikusize ugweme izingozi ezifihliwe futhi uthuthukise ukusebenza kahle kokukhiqiza.
I. Ukukhubazeka Kwenqubo Yokuhlanganisa: "Imodi Efihliwe" Yokubulala Okunembile
Ubukhulu obungalingani bongqimba olunamathelayo bubangela ukuthi ukuguga kungalawuleki
Inqubo yokuhlanganisa i-laser engajwayelekile ijwayele ukudala ukuchezuka kogqinsi lwesendlalelo sokunamathisela esidlula u-±0.1mm. Esivivinyweni sokuhamba ngebhayisikili esishisayo, umehluko ku-coefficient yokwandisa phakathi kwesendlalelo sokunamathisela kanye ne-granite (cishe 20×10⁻⁶/℃ yesendlalelo sokunamathisela kanye ne-5×10⁻⁶/℃ kuphela ye-granite) izobangela ukuguqulwa komugqa okungu-0.01mm/m. Ngenxa yongqimba olunamathelayo olujiyile ngokweqile, iphutha lokuma kwe-axis engu-Z yefekthri ethile yemishini yokubona iwohloka isuka ku-±2μm yaya ku-±8μm ngemva kokuba okokusebenza kade kusebenza izinyanga ezi-3.
2. Ukugxilisa ingcindezi kusheshisa ukwehluleka kwesakhiwo
Ukubambisana okungalungile kuholela ekusabalaliseni kwengcindezi okungalingani, okwenza ingcindezi yendawo engaphezu kuka-30MPa emaphethelweni esisekelo. Lapho okokusebenza kudlidliza ngesivinini esikhulu, ama-microcracks ajwayele ukwenzeka endaweni yokugxilisa ingqondo. Icala lesikhungo sokucubungula isikhunta sezimoto libonisa ukuthi iphutha lenqubo yokubopha lifinyeza impilo yesevisi yesisekelo ngo-40% futhi izindleko zokunakekela zikhuphuka ngo-65%.
Ii. I-Material Matching Trap: "Ubuthakathaka Obubi" obunganakwa
I-resonance ibangelwa ukuminyana kwegwadle okungafinyeleli ezingeni
Ukusebenza okudambisayo kwe-granite yekhwalithi ephansi (ukuminyana <2600kg/m³) kwehle ngo-30%, futhi ayikwazi ukumunca ngempumelelo amandla ngaphansi kokudlidliza kwe-high-frequency (20-50Hz) phakathi nokucubungula i-laser. Uhlolo lwangempela lwefekthri ye-PCB lubonisa ukuthi uma usebenzisa isisekelo segwadle esiminyana kancane, izinga lonqenqema olugayiwe ngesikhathi sokumba liphezulu ngokufika ku-12%, kuyilapho lelo lezinto zekhwalithi ephezulu lingu-2% kuphela.
2. I-adhesive inokumelana nokushisa okwanele
Izinto ezinamathelayo ezijwayelekile zingamelana namazinga okushisa angaphansi kuka-80℃. Endaweni enezinga lokushisa eliphezulu lokucutshungulwa kwe-laser (endaweni engaphezu kuka-150℃), isendlalelo sokunamathisela siyathamba, okubangela ukuthi isakhiwo esiyisisekelo sixege. Ibhizinisi elithile le-semiconductor lidale umonakalo kumakhanda e-laser abiza izigidi ngenxa yokwehluleka kwezinamathiselo.
Iii. Ingcuphe Yezitifiketi Ezishodayo: Izindleko Ezifihliwe "Zemikhiqizo Emithathu"
Isisekelo esingenaso isitifiketi se-CE kanye ne-ISO sifihla izingozi zokuphepha ezingaba khona:
I-radioactivity eyeqile: I-granite engabonakali ingase ikhulule igesi ye-radon, ibeke usongo empilweni yabasebenzisi.
Ukumakwa okungamanga komthamo wokuthwala umthwalo: Umthamo wangempela wokuthwala umthwalo ungaphansi kuka-60% yenani elimakiwe, okuholela engcupheni yokugingqika kwemishini.
Ukungathobeli ukuvikelwa kwemvelo: Izinamathiselo ezine-VOCS zingcolisa indawo yokusebenzela futhi zibhekene nezijeziso zokuvikela imvelo.
Iv. Umhlahlandlela Wokugwema Izingibe: "Umthetho Wegolide" Wokulawula Ikhwalithi
✅ Ukuhlolwa okuphindwe kabili kwezinto: Ukuminyana kwe-Granite (≥2800kg/m³) kanye nombiko wokuhlolwa kwe-radioactivity kuyadingeka;
✅ Ukubukwa kwenqubo: Khetha abahlinzeki abasebenzisa i-laser interferometer ukuze baqaphe ukujiya kokunamathela (iphutha ≤±0.02mm);
✅ Ukuhlolwa kokulingisa: ** ukuhamba ngebhayisikili okushisayo (-20 ° C kuya ku-80 ° C) + ukudlidliza (5-50Hz) ** idatha yokuhlola kabili iyadingeka;
✅ Isitifiketi Esiphelele: Qinisekisa ukuthi umkhiqizo une-CE, ISO 9001 nesitifiketi se-SGS semvelo.
Isikhathi sokuthumela: Jun-13-2025