Emkhakheni wokukhiqiza ama-semiconductor, ukunemba kwe-sub-micron kuyisihluthulelo sokuqinisekisa ukusebenza kwe-chip, futhi isisekelo se-granite (ZHHIMG®), esinezinto zayo ezibonakalayo, ukucutshungulwa okunembayo nokuklama okusha, sekube isiqinisekiso esiyinhloko sokufeza lokhu kunemba.
Ngokombono wezakhiwo ezibonakalayo, igwadle elimnyama elikhethwe yi-ZHHIMG® linesisindo esingaba ngu-3100kg/m³, elinokwakheka kwangaphakathi okuminyene. Lokhu kuminyana okuphezulu kuyenza ibe nokuzinza nokuqina okuvelele. Ngesikhathi sokusebenza kwemishini ye-semiconductor, ukujikeleza kwamamotho kanye nokunyakaza kwezakhi zemishini ngaphakathi kwemishini kuzokhiqiza ukudlidliza. Isisekelo segwadle singamunca ngempumelelo ngaphezu kuka-90% wamandla okudlidliza, sinciphise kakhulu umthelela wokudlidliza ekunembeni kwezinto zokusebenza. Phakathi naleso sikhathi, i-coefficient yayo ephansi kakhulu yokwandisa okushisayo iyenza ikwazi ukugcina ukuguquguquka kwayo ngaphakathi kwebanga elincane kakhulu lapho izinga lokushisa lendawo liguquguquka, linikeze isisekelo esizinzile sokusekela imishini ye-semiconductor nokuvimbela ukugudluzwa kwezingxenye zemishini ngenxa yokuguquka kwezinga lokushisa, okungase kuthinte ukunemba.
Mayelana nokucubungula nokukhiqiza, ifektri ye-ZHHIMG® isebenzisa imishini yokucubungula ethuthukisiwe yamazwe ngamazwe futhi inemishini emine yokugaya emikhulu kakhulu (umshini ngamunye ubiza ngaphezu kwe-500,000usd), engakwazi ukugaya ngokunemba okuphezulu ku-granite. Ngokuxhumanisa ama-axis amahlanu we-CNC machining nezinye izinqubo, ukucaba kwesisekelo somshini kungafinyelela izinga le-nanometer, kunikeze indawo yereferensi eyi-ultra-flat ukuze kufakwe okokusebenza kwe-semiconductor kanye nokuqinisekisa ukuma okunembile kwengxenye ngayinye yamathuluzi. Ngaphezu kwalokho, indawo yokusebenzela engaguquki yokushisa nomswakama (ehlanganisa indawo engamamitha-skwele ayi-10,000) inikeza indawo ezinzile yokucubungula. Imisele elwa nokudlidliza engu-500mm ububanzi no-2000mm ejulile eyizungezile, kanye nama-cranes athule, ahlukanisa ngempumelelo ukuphazamiseka kokudlidliza kwangaphandle futhi aqinisekise ukunemba kokucubungula kwesisekelo somshini.
Ngaphezu kwalokho, i-ZHHIMG® nayo inamandla okwenza ngokwezifiso aqinile. Ngezidingo ezikhethekile zemishini ye-semiconductor, izimbobo zokufaka ezinembile namathreyi ekhebula angenziwa ngaphambili ukuze kuzuzwe ukuhambisana okuphelele phakathi kwezinto zokusebenza nesisekelo. Ngesikhathi esifanayo, kuhlanganiswa ne-metrology esezingeni lomhlaba kanye nemishini yokuhlola efana ne-German Mahr gauge minute (ngokunemba okungu-0.5um) kanye nezinga le-elekthronikhi le-Swiss WYLER, isisekelo somshini sihlolwa ngokuqinile futhi silinganiswe ukuze kuqinisekiswe ukuthi isisekelo somshini ngamunye singahlangabezana nezidingo eziqinile ze-semiconductor ye-semiconductor yokunemba kwezinga le-sub-micron.
Inhlanganisela ngqo yalezi zinzuzo okwenza isisekelo segwadle se-ZHHIMG® sibe yisinqumo esithembekile sokuzuza ukunemba kwe-sub-micron kumshini we-semiconductor, okusiza ukukhiqizwa kwe-semiconductor ukuya ezinkambini ezinembayo eziphezulu.
Isikhathi sokuthumela: Jun-18-2025