Emkhakheni onembe kakhulu wokukhiqiza ama-semiconductor, ngisho nokudlidliza okuncane kungaba nomthelela omkhulu ekusebenzeni kwemishini yokufaka i-wafer slot, okuholela ekulimaleni nasekulahlekeni kwesivuno. Izisekelo zomshini we-granite zivele njengesixazululo segeyimu - esishintshayo, esinikeza ukudlidliza okungenakuqhathaniswa - amakhono okunciphisa abalulekile ekugcineni ubuqotho bokucutshungulwa kwe-wafer.
Ukuminyana Okuphezulu kanye Ne-inertia Yokucindezela Ukudlidliza
Ukuminyana okuphezulu kwe-granite, okuvamise ukusukela ku-2,600 kuya ku-3,100 kg/m³, kunikeza inertia enkulu. Uma ihlanganiswe emishinini yokufaka ama-wafer, lesi sici simelana nokudlidliza kwangaphandle ngempumelelo. Isibonelo, endaweni ematasa yefekthri ye-semiconductor, imishini ezungezile kanye nethrafikhi yezinyawo kungadala ukudlidliza kwe-ambient. Isisekelo somshini wegwadle, esinesisindo esinzima, sisebenza njengesisekelo esizinzile, sinciphisa ukudluliswa kwalokhu kudlidliza ezingxenyeni ezintekenteke zomshini wokugembula. Ngenxa yalokhu, amathuluzi okusika ahlala emile kahle, enciphisa ubungozi bokucisha - ukusikeka okuqondiwe kanye nokwenza ngcono ikhwalithi yonke yamawafa afakiwe.
Ukudlidliza Kwemvelo - Izakhiwo Ezidambisayo
Isakhiwo sangaphakathi esiyingqayizivele se-granite, esakhiwe ngezinhlamvu zamaminerali ezihlangene, ziyinikeza ukudlidliza okuhle kakhulu - amandla okudambisa. Lapho umshini wokusika ama-wafer usebenza, ukuzungezisa okuphezulu kwesivinini kwamathuluzi okusika namandla emishini ahilelekile kungenza ukudlidliza kwangaphakathi. I-Granite imunca futhi ihlakaze la mandla okudlidliza, iwavimbele ukuthi angasabeli ngesakhiwo somshini. Ngokungafani nezisekelo zensimbi ezingase zikhulise ukudlidliza, umphumela wokudambisa wemvelo we-granite uqinisekisa ukuthi umshini usebenza kahle. Ucwaningo lubonisa ukuthi ukusebenzisa izisekelo ze-granite kunganciphisa ama-amplitude okudlidliza aze afike ku-70%, okuvumela umshini wokushaya ukuze ugcine izinga eliphezulu lokunemba ngesikhathi sokusika.
Ukuzinza Okushisayo Ukuvimbela Ukudlidliza - Amaphutha Abangelwa
Ukushintshashintsha kwezinga lokushisa endaweni yokukhiqiza kungabangela izinto ezisetshenziswayo ukuthi zikhule noma zinciphe, okuholela ekungaqondiseni kahle nasekudlidlizeni okulandelayo. I-Granite ine-coefficient ephansi yokunwetshwa kokushisa, okusho ukuthi igcina umumo nobukhulu bayo ngisho nangaphansi kwamazinga okushisa ahlukahlukene. Emshinini we-wafer slotting, lokhu kuzinza kwe-thermal kubalulekile. Isibonelo, ngesikhathi sokukhiqiza okunwetshiwe, umshini ungase ushise ngenxa yokusebenza okuqhubekayo. Isisekelo segwadle siqinisekisa ukuthi izingxenye zomshini zihlala ziqondana ngokuqondile, zigwema noma yikuphi ukudlidliza okubangelwa ukushisa noma izinguquko zobukhulu ezingase zithinte ukunemba kwe-wafer slotting. Lokhu kuzinza kusiza ukuqinisekisa ikhwalithi engaguquki kuwo wonke amawafa acutshunguliwe.
Isisekelo Esiqinile Nesizinzile Sokunemba
Ukuqina kwe-granite kungenye into ebalulekile ekwehliseni ukudlidliza. Isakhiwo sayo esiqinile sinikeza isisekelo esizinzile somshini we-wafer slotting, ukuvimbela noma yikuphi ukunyakaza okungafuneki noma ukugoba. Ukunemba - indawo engaphansi yesisekelo somshini we-granite iphinde ivumele ukufakwa okunembile kwezingxenye zomshini, kuthuthukise ngokwengeziwe ukuzinza. Uma umshini ugxunyekwe ngokuqinile kusisekelo se-granite, ungasebenza ngesivinini esikhulu ngokudlidliza okuncane, unike amandla izikhathi zokucubungula ngokushesha ngaphandle kokudela ukunemba.
Real - World Success Stories
Esikhungweni sokukhiqiza se-semiconductor ehamba phambili, ukwamukelwa kwezisekelo zomshini we-granite emishinini yokufaka i-wafer slot kuholele ekuthuthukisweni okumangalisayo kwekhwalithi yokukhiqiza. Izakhiwo zokudlidliza - zokunciphisa igwadle zinciphise ukwenzeka kokuqhekeka okuncane kuma-wafers afakiwe, okwandisa izinga lokukhiqiza lisuka ku-85% laya ku-93%. Ukwengeza, ukuzinza okuthuthukisiwe kuvumele ukukhuphuka okungama-20% kwesivinini sokusebenza komshini, okuthuthukisa ukukhiqiza sekukonke.
Sengiphetha, izisekelo zomshini we-granite zidlala indima ebalulekile ekwehliseni ukudlidliza emishinini yokufaka i-wafer slotting. Ukuminyana kwabo okuphezulu, ukudlidliza - izakhiwo ezidambisayo, ukuzinza kokushisa, nokuqina kuhlangana ukudala indawo yokusebenza ezinzile nenembayo. Kubakhiqizi be-semiconductor abahlose ukuthuthukisa ikhwalithi nokusebenza kahle kokucutshungulwa kwe-wafer yabo, ukutshala imali ezisekelweni zemishini ye-granite kuyisixazululo esifakazelwe nesisebenzayo.
Isikhathi sokuthumela: Jun-12-2025