Emhlabeni wokukhiqiza okunembe kakhulu, iplatifomu yegwadle iwuphawu lokugcina. Kodwa-ke, abaningi abangaphandle kwemboni bacabanga ukuthi ukuphela okungenasici kanye ne-sub-micron flatness okutholwe kulezi zingxenye ezinkulu kuwumphumela wokuzenzakalela, umshini wobuchwepheshe obuphezulu. Iqiniso, njengoba silijwayeza e-ZHONGHUI Group (ZHHIMG®), liyinhlanganisela eyinkimbinkimbi yezicubu zezimboni kanye nobuciko bomuntu obungenakushintshwa.
Ukuqonda izinqubo ezihlukene zokuqeda—nokwazi ukuthi zisetshenziswa nini—kubalulekile ukuze kuhlangatshezwane nezidingo ezinembayo eziqinile zemikhakha efana ne-semiconductor lithography, i-high-end metrology, kanye nokuhlanganiswa kwe-aerospace okuthuthukisiwe.
I-Multi-Stage Journey to Precision
Ukwenziwa kwenkundla yegwadle ngokunemba akuyona inqubo eyodwa; kuwukulandelana okuqoshwe ngokucophelela kwezigaba zokususa izinto. Isiteji ngasinye siklanyelwe ukwehlisa ngokuhlelekile iphutha lejiyomethri kanye nokuqina kwendawo kuyilapho kuncishiswa ukucindezelwa kwangaphakathi kwempahla.
Uhambo luqala ngemva kokuba i-granite slab isisikwe ukuze ilingane nosayizi. Lesi sigaba sokuqala sincike emishinini esindayo ukususa ingxenye enkulu yezinto. Sisebenzisa imishini ye-CNC emikhulu ye-gantry noma yesitayela se-gantry enamasondo okugaya afakwe idayimane ukuze sibekezelele izinto ezisetshenziswayo ukuze zibekezeleleke. Lesi isinyathelo esibalulekile sokususwa kwezinto ezisebenzayo kanye nokusungula i-geometry yokuqala. Okubaluleke kakhulu, inqubo ihlale yenziwa imanzi. Lokhu kunciphisa ukushisa okukhiqizwa ukungqubuzana, kuvimbele ukuhlanekezela okushisayo okungangenisa izingcindezi zangaphakathi futhi kufake engcupheni ukuqina kwesikhathi eside kwengxenye.
I-Hand Lapping: I-Frontier Final of Flatness
Uma inqubo eyenziwe ngomshini isithathe indawo engaphezulu ngangokunokwenzeka, ukuphishekela ukunemba kwe-micron kanye ne-sub-micron kuyaqala. Yilapho ubuchwepheshe bomuntu buhlala bungenakuxoxisana nhlobo ezisekelweni zebanga eliphezulu.
Lesi sigaba sokugcina, esaziwa ngokuthi i-lapping, sisebenzisa i-slurry abrasive yamahhala—hhayi isondo lokugaya elingaguquki. Ingxenye isetshenziswa ngokumelene nepuleti eliyireferensi elikhulu, eliyisicaba, okubangela ukuthi izinhlayiya ezilumayo zigiqeke futhi zishelele, kukhishwe amanani amaminithi ezinto. Lokhu kufeza izinga eliphakeme lokushelela nokuvumelana kwejometri.
Ochwepheshe bethu abangomakadebona, abaningi abanolwazi olukhethekile lweminyaka engaphezu kwamashumi amathathu, benza lo msebenzi. Ziyingxenye yomuntu evala iluphu yokukhiqiza. Ngokungafani nokugaya kwe-CNC, okuwukukhiqiza kabusha okumile kokunemba komshini, ukuxhakathisa ngesandla kuyinqubo eguqukayo, evaliwe. Izingcweti zethu zihlala zima ukuze zihlole umsebenzi zisebenzisa ama-laser interferometer namazinga kagesi. Ngokusekelwe kule datha yesikhathi sangempela, benza ukulungiswa kwe-hyper-localized, bagaya kuphela izindawo eziphezulu ezinomfutho oqondile, okhanyayo. Leli khono lokuqhubeka nokulungisa kanye nokucwenga indawo engaphezulu yilo eliletha ukubekezelelana okusezingeni lomhlaba okudingekayo ku-DIN 876 Grade 00 noma ngaphezulu.
Ngaphezu kwalokho, i-lapping manual isebenzisa ingcindezi ephansi kanye nokushisa okuncane, okuvumela ingcindezi yemvelo ye-geological ngaphakathi kwe-granite ukuthi ikhulule ngokwemvelo ngaphandle kokwethula ukucindezelwa komshini okusha. Lokhu kuqinisekisa ukuthi inkundla igcina ukunemba kwayo amashumi eminyaka.
Ukukhetha Indlela Elungile Yokwenza Ngokwezifiso
Lapho usebenzisa ingxenye ye-granite yangokwezifiso—njengesisekelo esinembayo somshini Wokulinganisa Okudidiyelwe (CMM) noma isiteji esithwala umoya—ukukhetha indlela yokuqedela efanele kubaluleke kakhulu futhi kuncike ngokuqondile ekubekezeleni okudingekayo.
Ngezidingo ezijwayelekile noma izinhlelo zokusebenza zesakhiwo esimaholoholo, ukugaya ingaphezulu kwe-CNC kuvame kwanele. Kodwa-ke, ezinhlelweni ezifuna ukuzinza kwezinga le-micron (njengepuleti elingaphezulu lokuhlola) sithuthela ekugayeni okuncane okulandelwa ukuxhashazwa okukhanya okwenziwa ngesandla.
Kuzinhlelo zokusebenza ezinembe kakhulu—ezifana nezinkundla ze-semiconductor lithography kanye nezisekelo eziyinhloko ze-CMM—izindleko nesikhathi sokutshala imali ekugqitshweni kwezandla okunezinyathelo eziningi kufaneleke ngokuphelele. Iyona kuphela indlela ekwazi ukuqinisekisa Ukunemba Kokufunda Okuphindayo (ukuhlolwa kwangempela kokufana endaweni yonke) ezingeni le-sub-micron.
Kwa-ZHHIMG®, sinjiniyela inqubo ukuhlangabezana nezidingo zakho. Uma uhlelo lwakho lokusebenza ludinga indiza eyireferensi emelana nokukhukhuleka kwemvelo futhi isebenze kahle ngaphansi kwemithwalo enamandla amakhulu, inhlanganisela yomsebenzi womshini osindayo kanye nobuciko bomuntu obuzinikele ukuphela kwenketho esebenzayo. Sihlanganisa inqubo yokugaya ngokuqondile ohlelweni lwethu oluqinile lokulawula ikhwalithi eqinisekisiwe ye-ISO ukuze siqinisekise ukulandeleka negunya eliphelele emkhiqizweni wokugcina.
Isikhathi sokuthumela: Oct-17-2025