1. Ukunemba kobukhulu
I-Flatness: ukukhanya okungaphezulu kwesisekelo kufanele kufinyelele izinga eliphezulu kakhulu, futhi iphutha lokulala akufanele lidlule ± 0.5μm kunoma iyiphi indawo engu-100mm×100mm; Kuyo yonke indiza eyisisekelo, iphutha lokucaba lilawulwa ngaphakathi kuka-±1μm. Lokhu kuqinisekisa ukuthi izingxenye ezibalulekile zemishini ye-semiconductor, njengenhloko yokuchayeka yemishini ye-lithography kanye netafula lokuhlola lemishini yokuthola i-chip, ingafakwa ngokuzinza futhi isebenze endizeni enembayo ephezulu, iqinisekise ukunemba kwendlela yokubona kanye nokuxhumeka kwesekethe kwemishini, futhi igweme ukuchezuka kokufuduka kwezingxenye ezibangelwa isisekelo se-chip, esithinta ukukhiqizwa kwe-chip engalingani, okuthinta ukukhiqizwa kwe-chip. ukunemba.
Ukuqondile: Ukuqonda konqenqema ngalunye lwesisekelo kubalulekile. Ngokuya kobude, iphutha lokuqondisa akufanele lidlule ±1μm nge-1m ngayinye; Iphutha lokuqondisa kwe-diagonal lilawulwa phakathi kuka-±1.5μm. Ukuthatha umshini wokunemba okuphezulu kwe-lithography njengesibonelo, lapho ithebula lihamba eduze komzila wesitimela wesisekelo, ukuqondisa konqenqema lwesisekelo kuthinta ngokuqondile ukunemba kwe-trajectory yetafula. Uma ubuqotho bungekho ezingeni elifanele, iphethini ye-lithography izohlanekezelwa futhi yonakale, okuholela ekuncipheni kwesivuno sokukhiqiza ama-chip.
Ukufana: Iphutha lokufana lendawo engaphezulu nephansi yesisekelo kufanele ilawulwe phakathi kuka-±1μm. I-parallelism enhle ingaqinisekisa ukuzinza kwesikhungo sonke sokudonsela phansi ngemva kokufakwa kwemishini, futhi amandla engxenye ngayinye ayifani. Emishinini yokukhiqiza i-wafer ye-semiconductor, uma izindawo ezingaphezulu neziphansi zesisekelo zingahambelani, iwafa izotsheka ngesikhathi sokucutshungulwa, kuthinte ukufana kwenqubo njengokubotshwa nokunamathiswa, futhi ngaleyo ndlela kuthinte ukungaguquguquki kokusebenza kwe-chip.
Okwesibili, izici ezibonakalayo
Ukuqina: Ukuqina kwesisekelo se-granite impahla kufanele kufinyelele ukuqina kwe-Shore HS70 noma ngaphezulu. Ukuqina okuphezulu kungamelana ngokuphumelelayo nokugqoka okubangelwa ukunyakaza okuvamile kanye nokungqubuzana kwezingxenye ngesikhathi sokusebenza kwemishini, ukuqinisekisa ukuthi isisekelo singagcina usayizi ophezulu wokunemba ngemva kokusetshenziswa isikhathi eside. Emshinini wokupakisha we-chip, ingalo yerobhothi ivamise ukubamba futhi ibeke i-chip esisekelweni, futhi ukuqina okuphezulu kwesisekelo kungaqinisekisa ukuthi indawo engaphezulu akulula ukukhiqiza imihuzuko nokugcina ukunemba kokunyakaza kwengalo yerobhothi.
Ukuminyana: Ukuminyana kwezinto kufanele kube phakathi kuka-2.6-3.1 g/cm³. Ubuningi obufanele benza isisekelo sibe nokuzinza okuhle kwekhwalithi, okungaqinisekisa ukuqina okwanele ukusekela imishini, futhi ngeke kulethe ubunzima ekufakweni nasekuthuthweni kwemishini ngenxa yesisindo esiningi. Emishinini emikhulu yokuhlola i-semiconductor, ukuminyana kwesisekelo okuzinzile kusiza ukunciphisa ukudluliswa kokudlidliza ngesikhathi sokusebenza kwemishini nokuthuthukisa ukunemba kokutholwa.
Ukuzinza kokushisa: i-coefficient yomugqa yokunweba ingaphansi kuka-5×10⁻⁶/℃. Imishini ye-Semiconductor izwela kakhulu ekushintsheni kwezinga lokushisa, futhi ukuzinza kokushisa kwesisekelo kuhlobene ngokuqondile nokunemba kwemishini. Phakathi nenqubo ye-lithography, ukushintshashintsha kwezinga lokushisa kungabangela ukunwetshwa noma ukufinyela kwesisekelo, okuholela ekuphambukeni kusayizi wephethini yokuchayeka. Isisekelo segwadle esinomugqa ophansi wokunwetshwa kwe-coefficient singalawula ukushintsha kosayizi ebangeni elincane kakhulu lapho izinga lokushisa lokusebenza lemishini lishintsha (ngokuvamile li-20-30 ° C) ukuze kuqinisekiswe ukunemba kwe-lithography.
Okwesithathu, izinga eliphezulu
Ukuqina: Ubushelelezi obungaphezulu Inani lika-Ra kusisekelo alidluli u-0.05μm. Indawo ebushelelezi kakhulu inganciphisa ukukhangezwa kothuli nokungcola futhi inciphise umthelela ekuhlanzekeni kwendawo yokukhiqiza i-semiconductor chip. Ku-workshop engenalo uthuli yokukhiqiza ama-chip, izinhlayiya ezincane zingase ziholele ekushiyekeni okufana nokujikeleza okufushane kwe-chip, futhi indawo ebushelelezi yesisekelo isiza ukugcina indawo ehlanzekile yendawo yokusebenzela futhi ithuthukise isivuno se-chip.
Amaphutha amancane: Ingaphezulu lesisekelo alivunyelwe ukuthi libe nemifantu ebonakalayo, izimbobo zesihlabathi, ama-pores nokunye ukukhubazeka. Ezingeni le-microscopic, inani leziphambeko ezinobubanzi obukhulu kuno-1μm ngesentimitha yesikwele akufanele lidlule ku-3 nge-electron microscopy. Lezi zinkinga zizothinta amandla esakhiwo kanye nokuvuleka kwendawo yesisekelo, bese kuthinta ukuzinza nokunemba kwemishini.
Okwesine, ukuzinza nokumelana nokushaqeka
Ukuzinza kwe-Dynamic: Endaweni yokudlidliza efanisiwe ekhiqizwe ukusebenza kwemishini ye-semiconductor (ibanga lefrikhwensi yokudlidliza 10-1000Hz, amplitude 0.01-0.1mm), ukugudluzwa kokudlidliza kwamaphoyinti abalulekile okukhweza esisekelweni kufanele kulawulwe phakathi kuka-±0.05μm. Ukuthatha okokusebenza kokuhlolwa kwe-semiconductor njengesibonelo, uma ukudlidliza kwedivayisi kanye nokudlidliza kwendawo ezungezile kudluliselwa kusisekelo phakathi nokusebenza, ukunemba kwesignali yokuhlola kungase kuphazamiseke. Ukuzinza okuhle okuguquguqukayo kungaqinisekisa imiphumela yokuhlolwa ethembekile.
Ukumelana nokuzamazama komhlaba: Isisekelo kufanele sibe nokusebenza okuhle kakhulu kokuzamazama komhlaba, futhi singanciphisa ngokushesha amandla okudlidliza lapho engaphansi kokudlidliza kwangaphandle okungazelelwe (okufana nokudlidliza kwegagasi lokuzamazama komhlaba), futhi siqinisekise ukuthi indawo ehlobene yezingxenye ezibalulekile zemishini iyashintsha phakathi kuka-±0.1μm. Ezimbonini ze-semiconductor ezindaweni ezithandwa ukuzamazama komhlaba, izisekelo ezimelana nokuzamazama komhlaba zingavikela ngokuphumelelayo imishini ebizayo ye-semiconductor, ukunciphisa ingozi yokulimala kwemishini kanye nokuphazamiseka kokukhiqiza ngenxa yokudlidliza.
5. Ukuzinza kwamakhemikhali
Ukumelana nokugqwala: Isisekelo se-granite kufanele simelane nokugqwala kwama-ejenti amakhemikhali avamile ohlelweni lokukhiqiza lwe-semiconductor, njenge-hydrofluoric acid, i-aqua regia, njll. Ngemva kokucwiliswa kusisombululo se-hydrofluoric acid ngengxenye enkulu engu-40% amahora angu-24, izinga lokulahlekelwa kwekhwalithi ephezulu akufanele lidlule u-0.01%; Gcoba ku-aqua regia (ivolumu yesilinganiso se-hydrochloric acid ukuya ku-nitric acid 3:1) amahora angu-12, futhi azikho izimpawu zokugqwala ezisobala. Inqubo yokukhiqiza i-semiconductor ihlanganisa izinqubo ezihlukahlukene zokufaka amakhemikhali nokuhlanza, futhi ukumelana okuhle kokugqwala kwesisekelo kungaqinisekisa ukuthi ukusetshenziswa kwesikhathi eside endaweni yamakhemikhali akuguguleki, futhi ukunemba nobuqotho besakhiwo kugcinwa.
I-Anti-pollution: Izinto eziyisisekelo zinokumuncwa okuphansi kakhulu kokungcola okuvamile endaweni yokukhiqiza i-semiconductor, njengamagesi aphilayo, ama-ion ensimbi, njll. Uma ibekwe endaweni equkethe u-10 PPM wamagesi aphilayo (isb., benzene, toluene) kanye no-1ppm wama-ion ensimbi (isb, ama-ion ethusi, ama-ion e-copper, ama-iron ion abangelwa ukushintsha kwe-iron amahora angu-72, i-iron adpsor amahora angu-72) indawo engaphansi ayinalutho. Lokhu kuvimbela ukungcola ekufudukeni kusuka endaweni eyisisekelo kuya endaweni yokukhiqiza ama-chip futhi kuthinte ikhwalithi ye-chip.
Isikhathi sokuthumela: Mar-28-2025