1. Ukunemba kobukhulu
Ukuthamba: ukuthamba kobuso besisekelo kufanele kufinyelele izinga eliphezulu kakhulu, futhi iphutha lokuthamba akufanele lidlule u-±0.5μm kunoma iyiphi indawo engu-100mm×100mm; Kuyo yonke indiza yesisekelo, iphutha lokuthamba lilawulwa ngaphakathi kuka-±1μm. Lokhu kuqinisekisa ukuthi izingxenye ezibalulekile zemishini ye-semiconductor, njengekhanda lokuchayeka kwemishini ye-lithography kanye netafula le-probe yemishini yokuthola ama-chip, zingafakwa futhi zisebenze kahle endizeni enembile kakhulu, kuqinisekiswe ukunemba kwendlela yokukhanya kanye nokuxhumeka kwesekethe yemishini, futhi kugwenywe ukuphambuka kokufuduka kwezingxenye okubangelwa yindiza engalingani yesisekelo, okuthinta ukukhiqizwa kwama-chip e-semiconductor kanye nokunemba kokutholwa.
Ukuqonda: Ukuqonda komphetho ngamunye wesisekelo kubalulekile. Ebuchosheni, iphutha lokuqonda akufanele lidlule u-±1μm nge-1m; Iphutha lokuqonda okuqondile lilawulwa ngaphakathi kuka-±1.5μm. Uma kuthathwa umshini we-lithography onembile kakhulu njengesibonelo, lapho itafula lihamba eceleni kwereyili yokuqondisa yesisekelo, ukunemba komphetho wesisekelo kuthinta ngqo ukunemba kwendlela yetafula. Uma ukunemba kungenaso isilinganiso esijwayelekile, iphethini ye-lithography izophambuka futhi ikhubazeke, okuholela ekunciphiseni kwesivuno sokukhiqiza ama-chip.
Ukulingana: Iphutha lokufana kwezindawo eziphezulu nezingezansi zesisekelo kufanele lilawulwe ngaphakathi kuka-±1μm. Ukulingana okuhle kungaqinisekisa ukuzinza kwesikhungo sokudonsa amandla ngemva kokufakwa kwemishini, futhi amandla engxenye ngayinye afana. Emishinini yokukhiqiza i-wafer ye-semiconductor, uma izindawo eziphezulu nezingezansi zesisekelo zingalingani, i-wafer izothambekela ngesikhathi sokucubungula, ithinte ukufana kwenqubo njengokuchoboza nokufaka, ngaleyo ndlela ithinte ukuhambisana kokusebenza kwe-chip.
Okwesibili, izici zezinto ezibonakalayo
Ukuqina: Ukuqina kwezinto eziyisisekelo se-granite kufanele kufinyelele ku-Shore hardness HS70 noma ngaphezulu. Ukuqina okuphezulu kungamelana ngempumelelo nokuguguleka okubangelwa ukunyakaza okuvamile kanye nokungqubuzana kwezingxenye ngesikhathi sokusebenza kwemishini, okuqinisekisa ukuthi isisekelo singagcina usayizi onembile kakhulu ngemva kokusetshenziswa isikhathi eside. Emishinini yokupakisha ama-chip, ingalo yerobhothi ivame ukubamba futhi ibeke i-chip esisekelweni, futhi ubunzima obukhulu besisekelo bungaqinisekisa ukuthi indawo engaphezulu akulula ukukhiqiza imihuzuko nokugcina ukunemba kokunyakaza kwengalo yerobhothi.
Ubuningi: Ubuningi bezinto kufanele bube phakathi kuka-2.6-3.1 g/cm³. Ubuningi obufanele benza isisekelo sibe nokuqina kwekhwalithi enhle, okungaqinisekisa ukuqina okwanele ukusekela imishini, futhi ngeke kulethe ubunzima ekufakweni nasekuthuthweni kwemishini ngenxa yesisindo esiningi. Emishinini emikhulu yokuhlola i-semiconductor, ubuningi besisekelo esizinzile kusiza ukunciphisa ukudluliselwa kokudlidliza ngesikhathi sokusebenza kwemishini nokuthuthukisa ukunemba kokutholwa.
Ukuqina kokushisa: i-coefficient yokwandisa okuqondile ingaphansi kuka-5×10⁻⁶/℃. Imishini ye-semiconductor ibucayi kakhulu ekushintsheni kokushisa, futhi ukuqina kokushisa kwesisekelo kuhlobene ngqo nokunemba kwemishini. Ngesikhathi senqubo ye-lithography, ukuguquguquka kwezinga lokushisa kungabangela ukwanda noma ukufinyela kwesisekelo, okuholela ekuphambukeni kosayizi wephethini yokuchayeka. Isisekelo se-granite esine-coefficient yokwandisa okuqondile ephansi singalawula ushintsho losayizi ebangeni elincane kakhulu lapho izinga lokushisa lokusebenza kwemishini lishintsha (ngokuvamile 20-30 ° C) ukuqinisekisa ukunemba kwe-lithography.
Okwesithathu, ikhwalithi yobuso
Ubulukhuni: Ubulukhuni bomphezulu Inani le-Ra esisekelweni alidluli ku-0.05μm. Ubuso obubushelelezi kakhulu bunganciphisa ukumuncwa kothuli nokungcola futhi bunciphise umthelela ekuhlanzekeni kwendawo yokukhiqiza ama-chip e-semiconductor. Emsebenzini wokukhiqiza ama-chip ongenalo uthuli, izinhlayiya ezincane zingaholela ezifweni ezifana nokujikeleza okufushane kwe-chip, kanti ubuso obubushelelezi besisekelo buyasiza ekugcineni indawo ehlanzekile ye-workshop futhi kuthuthukiswe isivuno sama-chip.
Amaphutha e-Microscopic: Ubuso besisekelo abuvunyelwe ukuba nemifantu ebonakalayo, imigodi yesihlabathi, izikhala kanye nezinye izinkinga. Ezingeni le-microscopic, inani lamaphutha anobubanzi obungaphezu kuka-1μm ngesentimitha lesikwele akumele lidlule ku-3 nge-electron microscopy. La maphutha azothinta amandla esakhiwo kanye nokuthamba komphezulu wesisekelo, bese ethinta ukuzinza nokunemba kwemishini.
Okwesine, ukuzinza nokumelana nokushaqeka
Ukuqina okuguquguqukayo: Endaweni yokudlidliza okulingisiwe okudalwe ukusebenza kwemishini ye-semiconductor (ibanga lokuvama kokudlidliza 10-1000Hz, ubukhulu obungu-0.01-0.1mm), ukufuduka kokudlidliza kwamaphoyinti okufaka ayisihluthulelo esisekelweni kufanele kulawulwe ngaphakathi kuka-±0.05μm. Uma sithatha imishini yokuhlola ye-semiconductor njengesibonelo, uma ukudlidliza kwedivayisi kanye nokudlidliza kwendawo ezungezile kudluliselwa esisekelweni ngesikhathi sokusebenza, ukunemba kwesignali yokuhlola kungaphazanyiswa. Ukuqina okuhle okuguquguqukayo kungaqinisekisa imiphumela yokuhlola ethembekile.
Ukumelana nokuzamazama komhlaba: Isisekelo kumele sibe nokusebenza okuhle kakhulu kokuzamazama komhlaba, futhi singanciphisa ngokushesha amandla okuzamazama komhlaba lapho sibhekene nokuzamazama kwangaphandle okungazelelwe (njengokuzamazama komhlaba ngegagasi), futhi siqinisekise ukuthi indawo ehlobene yezingxenye ezibalulekile zemishini iyashintsha ngaphakathi kuka-±0.1μm. Emafektri e-semiconductor ezindaweni ezivame ukuzamazama komhlaba, izisekelo ezingamelana nokuzamazama komhlaba zingavikela ngempumelelo imishini ye-semiconductor ebizayo, kuncishiswe ingozi yomonakalo wemishini kanye nokuphazamiseka kokukhiqiza ngenxa yokuzamazama komhlaba.
5. Ukuqina kwamakhemikhali
Ukumelana nokugqwala: Isisekelo se-granite kufanele simelane nokugqwala kwama-chemical agents avamile enqubweni yokukhiqiza i-semiconductor, njenge-hydrofluoric acid, i-aqua regia, njll. Ngemva kokucwilisa isisombululo se-hydrofluoric acid ngengxenye yobuningi engu-40% amahora angama-24, izinga lokulahlekelwa yikhwalithi yobuso akufanele lidlule u-0.01%; Cwilisa ku-aqua regia (isilinganiso somthamo we-hydrochloric acid ku-nitric acid engu-3:1) amahora ayi-12, futhi akukho zimpawu ezicacile zokugqwala ebusweni. Inqubo yokukhiqiza i-semiconductor ihilela izinqubo ezahlukahlukene zokuqopha nokuhlanza amakhemikhali, futhi ukumelana okuhle kokugqwala kwesisekelo kungaqinisekisa ukuthi ukusetshenziswa kwesikhathi eside endaweni yamakhemikhali akuguguleki, futhi ukunemba nobuqotho besakhiwo kuyagcinwa.
Ukulwa nokungcola: Izinto eziyisisekelo azikwazi ukumunca ukungcola okuvamile endaweni yokukhiqiza ye-semiconductor, njengegesi eziphilayo, ama-ion ensimbi, njll. Uma zibekwe endaweni equkethe ama-10 PPM amagesi emvelo (isb., i-benzene, i-toluene) kanye ne-1ppm yama-ion ensimbi (isb., ama-ion ethusi, ama-ion ensimbi) amahora angama-72, ushintsho lokusebenza olubangelwa ukumuncwa kokungcola ebusweni besisekelo alunamsebenzi. Lokhu kuvimbela ukungcola ukuthi kusuke ebusweni besisekelo kuye endaweni yokukhiqiza ama-chip futhi kuthinte ikhwalithi yama-chip.
Isikhathi sokuthunyelwe: Mashi-28-2025