Enkambisweni yomkhakha we-semiconductor oqhubekela phambili ezinqubweni zokukhiqiza ze-nanoscale, ukusika i-wafer, njengesixhumanisi esibalulekile ekukhiqizeni ama-chip, kunezidingo eziqinile kakhulu zokuqina kwemishini. Isisekelo se-granite, esinokumelana kwayo okuvelele kokudlidliza kanye nokuqina kokushisa, sesibe yingxenye eyinhloko yemishini yokusika i-wafer, enikeza isiqinisekiso esithembekile sokufeza ukucutshungulwa kwe-wafer okunembe kakhulu nokusebenza kahle kakhulu.
Izici zokudambisa okuphezulu kanye nokulwa nokudlidliza: Ukuvikela ukunemba kokusika kwezinga elincane
Uma imishini yokusika i-wafer isebenza, ukujikeleza kwesivinini esikhulu se-spindle, ukudlidliza kwemvamisa ephezulu kwethuluzi lokusika, kanye nokudlidliza kwemvelo okukhiqizwa imishini ezungezile konke kuzoba nomthelela omkhulu ekunembeni kokusika. Ukusebenza kokufiphaza kwezisekelo zensimbi zendabuko kunqunyelwe, okwenza kube nzima ukunciphisa ukudlidliza ngokushesha, okuholela ekujikeni kwezinga le-micron lamathuluzi okusika futhi kubangele ngqo amaphutha afana nemiphetho eqhekekile kanye nemifantu kuma-wafer. Izici zokufiphaza okuphezulu kwesisekelo se-granite zixazulule le nkinga ngokuyisisekelo.
Amakristalu amaminerali angaphakathi e-granite ahlanganiswe eduze, akha isakhiwo semvelo sokuhlakazeka kwamandla. Lapho ukudlidliza kudluliselwa esisekelweni, isakhiwo saso sangaphakathi singaguqula ngokushesha amandla okudlidliza abe amandla okushisa, kufezwe ukuncipha kokudlidliza okusebenzayo. Idatha yokuhlola ikhombisa ukuthi ngaphansi kwendawo efanayo yokudlidliza, isisekelo se-granite singanciphisa ubukhulu bokudlidliza ngaphezu kwama-90% ngaphakathi kwemizuzwana engu-0.5, kuyilapho isisekelo sensimbi sidinga imizuzwana emi-3 kuya kwemi-5. Lokhu kusebenza okuvelele kokunciphisa kuqinisekisa ukuthi ithuluzi lokusika lihlala lizinzile ngesikhathi senqubo yokusika ye-nanoscale, okuqinisekisa umkhawulo obushelelezi wokusika kwe-wafer futhi kunciphisa ngempumelelo izinga lokuchipha. Isibonelo, enkambisweni yokusika i-wafer engu-5nm, imishini enesisekelo se-granite ingalawula usayizi wokuchipha ngaphakathi kwama-10μm, okungaphezu kwama-40% kunowemishini enesisekelo sensimbi.
I-coefficient ephansi kakhulu yokwanda kokushisa: Imelana nethonya lokushintshashintsha kwezinga lokushisa
Ngesikhathi senqubo yokusika i-wafer, ukushisa okubangelwa ukungqubuzana kwamathuluzi okusika, ukushabalaliswa kokushisa okuvela ekusebenzeni kwesikhathi eside kwemishini, kanye nezinguquko ekushiseni kwendawo yokusebenza konke kungabangela ukuguqulwa kokushisa kwezingxenye zemishini. I-coefficient yokwanda kokushisa kwezinto zensimbi iphakeme kakhulu (cishe i-12×10⁻⁶/℃). Lapho izinga lokushisa lishintsha ngo-5℃, isisekelo sensimbi esingamamitha angu-1 ubude singase siguqulwe sibe ngu-60μm, okubangela ukuthi indawo yokusika ishintshe futhi kuthinte kakhulu ukunemba kokusika.
I-coefficient yokwanda kokushisa kwesisekelo se-granite ingu-(4-8) ×10⁻⁶/℃ kuphela, okungaphansi kwengxenye eyodwa kwezintathu yezinto zensimbi. Ngaphansi kokushintsha kokushisa okufanayo, ushintsho lwayo lobukhulu lungacishe lunganakwa. Idatha elinganisiwe yebhizinisi elithile lokukhiqiza i-semiconductor ikhombisa ukuthi ngesikhathi sokusebenza kokusika i-wafer enamandla aphezulu kwamahora angu-8, lapho izinga lokushisa elizungezile lishintsha ngo-10℃, indawo yokusika engaphansi kwemishini enesisekelo se-granite ingaphansi kuka-20μm, kuyilapho leyo yemishini enesisekelo sensimbi idlula u-60μm. Lokhu kusebenza kokushisa okuzinzile kuqinisekisa ukuthi indawo ehlobene phakathi kwethuluzi lokusika ne-wafer ihlala inembile ngaso sonke isikhathi. Ngisho nangaphansi kokusebenza okuqhubekayo kwesikhathi eside noma izinguquko ezinkulu ekushiseni kwemvelo, ukuhambisana kokunemba kokusika kungagcinwa.
Ukuqina nokumelana nokuguguleka: Qinisekisa ukusebenza okuzinzile kwesikhathi eside kwemishini
Ngaphezu kwezinzuzo zokumelana nokudlidliza kanye nokuqina kokushisa, ukuqina okuphezulu kanye nokumelana nokuguguleka kwesisekelo se-granite kuthuthukisa kakhulu ukuthembeka kwemishini yokusika i-wafer. I-Granite inobulukhuni obungu-6 kuya ku-7 esikalini se-Mohs kanye namandla okucindezela adlula i-120MPa. Ingamelana nokucindezela okukhulu kanye namandla okushaya ngesikhathi senqubo yokusika futhi ayithambekeli ekuguqukeni. Okwamanje, isakhiwo sayo esiqinile siyinika ukumelana okuhle kakhulu kokuguguleka. Ngisho nangesikhathi sokusika okuvamile, ubuso besisekelo abuthambekeli ekugugulekeni, okuqinisekisa ukuthi imishini igcina ukusebenza okunembe kakhulu isikhathi eside.
Ezisetshenzisweni ezisebenzayo, amabhizinisi amaningi okukhiqiza ama-wafer athuthukise kakhulu isivuno somkhiqizo kanye nokusebenza kahle kokukhiqiza ngokusebenzisa imishini yokusika enezisekelo ze-granite. Imininingwane evela enkampanini eholayo emhlabeni wonke ikhombisa ukuthi ngemuva kokwethula imishini yesisekelo se-granite, isivuno sokusika ama-wafer sikhuphuke sisuka ku-88% saya ngaphezu kuka-95%, umjikelezo wokugcinwa kwemishini unwetshwe kathathu, okunciphisa ngempumelelo izindleko zokukhiqiza kanye nokuthuthukisa ukuncintisana kwemakethe.
Ekuphetheni, isisekelo se-granite, ngokumelana kwaso okuhle kakhulu kokudlidliza, ukuzinza kokushisa, ukuqina okuphezulu kanye nokumelana nokuguguleka, sinikeza iziqinisekiso zokusebenza eziphelele zemishini yokusika i-wafer. Njengoba ubuchwepheshe be-semiconductor buqhubekela phambili ekuqondeni okuphezulu, izisekelo ze-granite zizodlala indima ebaluleke kakhulu emkhakheni wokukhiqiza i-wafer, zikhuthaza intuthuko eqhubekayo entsha yemboni ye-semiconductor.
Isikhathi sokuthunyelwe: Meyi-20-2025