Enqubweni yemboni ye-semiconductor iqhubekela kuzinqubo zokukhiqiza i-nanoscale, ukusika kwe-wafer, njengesixhumanisi esibalulekile ekukhiqizeni ama-chip, kunezidingo eziqinile kakhulu zokuzinza kwemishini. Isisekelo se-granite, esinokumelana nokudlidliza okuvelele kanye nokuzinza kokushisa, sesiyingxenye eyinhloko yemishini yokusika i-wafer, enikeza isiqinisekiso esithembekile sokufeza ukucutshungulwa kwe-wafer okunemba okuphezulu nokusebenza kahle kakhulu. .
Izici zokudambisa okuphezulu kanye nezinqanda ukudlidliza: Ukuvikela ukunemba kokusika kweleveli ye-nano
Lapho umshini wokusika i-wafer usebenza, ukuzungezisa ngesivinini esiphezulu kwe-spindle, ukudlidliza kwe-high-frequency vibration yethuluzi lokusika, kanye nokudlidliza kwemvelo okukhiqizwa izinto ezizungezile konke kuzoba nomthelela obalulekile ekunembeni kokusika. Ukusebenza okudambisayo kwezisekelo zensimbi ezivamile kukhawulelwe, okwenza kube nzima ukunqanda ngokushesha ukudlidliza, okuholela ku-jitter yeleveli ye-micron yamathuluzi okusika futhi kubangele ngokuqondile amaphutha njengamaphethelo aqoshiwe kanye nokuqhekeka kwamawafa. Izici zokumanzisa okuphezulu kwesisekelo se-granite ziyixazulule ngokuyisisekelo le nkinga. .
Amakristalu amaminerali angaphakathi e-granite ahlanganiswe eduze, enza isakhiwo sokulahla amandla emvelo. Uma ukudlidliza kudluliselwa esisekelweni, i-microstructure yayo yangaphakathi ingaguqulela ngokushesha amandla okudlidliza abe amandla ashisayo, kuzuze ukuncishiswa kokudlidliza okuphumelelayo. Idatha yokuhlola ibonisa ukuthi ngaphansi kwendawo efanayo yokudlidliza, isisekelo segwadle singanciphisa i-amplitude yokudlidliza ngaphezu kuka-90% phakathi kwamasekhondi angu-0.5, kuyilapho isisekelo sensimbi sidinga amasekhondi angu-3 kuya kwangu-5. Lokhu kusebenza okudambisayo okuvelele kuqinisekisa ukuthi ithuluzi lokusika lihlala lizinzile phakathi nenqubo yokusika i-nanoscale, iqinisekisa unqenqema olubushelelezi lwe-wafer cut kanye nokunciphisa ngempumelelo izinga lokusika. Isibonelo, kunqubo yokusika i-wafer engu-5nm, okokusebenza okunesisekelo se-granite kungalawula usayizi wokuchopha ngaphakathi kuka-10μm, ongaphezu kuka-40% ngaphezu kwalowo wezinto zokusebenza ezinesisekelo sensimbi. .
I-coefficient ephansi kakhulu yokunwetshwa kwe-thermal: Imelana nethonya lokushintshashintsha kwezinga lokushisa
Ngesikhathi senqubo yokusika i-wafer, ukushisa okukhiqizwa ukungqubuzana kwamathuluzi okusika, ukuchithwa kokushisa okuvela ekusebenzeni kwesikhathi eside kwemishini, kanye nezinguquko ekushiseni kwendawo yokusebenzela kungabangela ukuguquguquka okushisayo kwezingxenye zemishini. I-coefficient yokunwetshwa okushisayo kwezinto zensimbi iphakeme kakhulu (cishe 12×10⁻⁶/℃). Lapho izinga lokushisa liguquguquka ngo-5℃, isisekelo sensimbi esingamamitha angu-1 ubude singase sishintshe sibe ngu-60μm, okubangele ukuthi indawo yokusika ishintshe futhi kube nomthelela omkhulu ekunembeni kokusika. .
I-coefficient yokunwetshwa okushisayo kwesisekelo se-granite kuphela (4-8) ×10⁻⁶/℃, okungaphansi kokukodwa kokuthathu kwalokho kwezinto zensimbi. Ngaphansi kokushintsha kwezinga lokushisa okufanayo, ukuguquka kobukhulu bayo cishe kungashaywa indiva. Idatha elinganisiwe yebhizinisi elithile elikhiqiza i-semiconductor ibonisa ukuthi phakathi nomsebenzi wokusika owenziwe nge-semiconductor oqhubekayo wamahora angu-8, lapho izinga lokushisa elizungezile liguquguquka ngo-10℃, indawo yokusika ye-offset yesisetshenziswa esinesisekelo se-granite singaphansi kuka-20μm, kuyilapho leso sisetshenziswa esinesisekelo sensimbi sidlula u-60μm. Lokhu kusebenza okushisayo okuzinzile kuqinisekisa ukuthi indawo ehlobene phakathi kwethuluzi lokusika kanye ne-wafer ihlala inembile ngaso sonke isikhathi. Ngisho nangaphansi kokusebenza okuqhubekayo kwesikhathi eside noma izinguquko ezinkulu ekushiseni kwemvelo, ukuvumelana kokusika ukunemba kungagcinwa. .
Ukuqina nokumelana nokugqoka: Qinisekisa ukusebenza okuzinzile kwesikhathi eside kwemishini
Ngaphezu kwezinzuzo zokumelana nokudlidliza nokuzinza kokushisa, ukuqina okuphezulu nokumelana nokugqokwa kwesisekelo se-granite sithuthukisa ukuthembeka kwemishini yokusika eyi-wafer. I-Granite inobunzima obungu-6 kuya ku-7 esikalini se-Mohs namandla acindezelayo angaphezu kuka-120MPa. Ingakwazi ukumelana nokucindezela okukhulu namandla omthelela phakathi nenqubo yokusika futhi ayithambekele ekuphendukeni. Ngaleso sikhathi, ukwakheka kwayo okuminyene kuyinikeza ukumelana okuhle kakhulu nokugqoka. Ngisho nangesikhathi sokusika njalo, ingaphezulu lesisekelo alijwayele ukugqoka, ukuqinisekisa ukuthi imishini igcina ukusebenza okunembile isikhathi eside. .
Ekusetshenzisweni okungokoqobo, amabhizinisi amaningi akhiqiza ama-wafer athuthukise kakhulu umkhiqizo kanye nokusebenza kahle kokukhiqiza ngokwamukela imishini yokusika enezisekelo zegwadle. Idatha evela embonini ehamba phambili emhlabeni jikelele ibonisa ukuthi ngemva kokwethula imishini yesisekelo se-granite, isivuno sokusika i-wafer sikhuphuke sisuka ku-88% saya ngaphezu kuka-95%, umjikelezo wokulungisa imishini unwetshwe izikhathi ezintathu, ukwehlisa ngempumelelo izindleko zokukhiqiza kanye nokuthuthukisa ukuncintisana kwemakethe. .
Sengiphetha, isisekelo se-granite, esinokumelana nokudlidliza okuhle kakhulu, ukuzinza kokushisa, ukuqina okuphezulu nokumelana nokugqoka, sinikeza iziqinisekiso eziphelele zokusebenza kwemishini yokusika eyilucwecwana. Njengoba ubuchwepheshe be-semiconductor buthuthukela ekunembeni okuphezulu, izisekelo ze-granite zizodlala indima ebaluleke kakhulu emkhakheni wokukhiqiza ama-wafer, ukukhuthaza ukuthuthuka okuqhubekayo kwemboni ye-semiconductor.
Isikhathi sokuthumela: May-20-2025