Egagasini lokuthuthukiswa komkhakha we-LED kubuchwepheshe be-LED, ukunemba kwemishini yokubopha ngodayi kunquma ngqo isivuno sokupakisha ama-chip kanye nokusebenza komkhiqizo. I-ZHHIMG, ngokuhlanganiswa kwayo okujulile kwesayensi yezinto zokwakha kanye nokukhiqizwa kokunemba, inikeza ukwesekwa okubalulekile kwemishini yokubopha ngodayi ye-LED futhi isibe yithonya elibalulekile eliqhuba ukusungula izinto ezintsha kwezobuchwepheshe embonini.
Ukuqina nokuqina okuphezulu kakhulu: Ukuqinisekisa ukunemba kokubopha kwe-micron-level die
Inqubo yokubopha ama-die yama-LED idinga ukubopha okunembile kwama-chip anosayizi we-micron (ngosayizi omncane kakhulu ofinyelela ku-50μm×50μm) ku-substrate. Noma yikuphi ukuguqulwa kwesisekelo kungabangela ukuthi ukubopha kwama-die kushintshe. Ubuningi bezinto ze-ZHHIMG bufinyelela ku-2.7-3.1g/cm³, futhi amandla ayo okucindezela adlula u-200MPa. Ngesikhathi sokusebenza kwemishini, ingamelana ngempumelelo nokudlidliza nokushaqeka okubangelwa ukunyakaza kwemvamisa ephezulu kwekhanda lokubopha ama-die (kufika ezikhathini ezingu-2000 ngomzuzu). Ukulinganiswa kwangempela kwebhizinisi le-LED elihamba phambili kukhombisa ukuthi imishini yokubopha ama-die esebenzisa isisekelo se-ZHHIMG ingalawula i-chip offset ngaphakathi kwe-±15μm, okuphakeme ngo-40% kunemishini yesisekelo yendabuko futhi ihlangabezana ngokugcwele nezidingo eziqinile ze-JEDEC J-STD-020D standard yokunemba kokubopha ama-die.
Ukuzinza okuvelele kokushisa: Ukubhekana nenselele yokwenyuka kwezinga lokushisa kwemishini
Ukusebenza kwesikhathi eside kwemishini yokubopha i-die kungabangela ukwenyuka kwezinga lokushisa lendawo (kufika ku-50℃), kanti ukwanda kokushisa kwezinto ezivamile kungashintsha indawo ehlobene phakathi kwekhanda lokubopha i-die kanye ne-substrate. I-coefficient yokwanda kokushisa kwe-ZHHIMG iphansi njenge-(4-8) ×10⁻⁶/℃, okuyisigamu nje sensimbi ephonswe ngensimbi. Ngesikhathi sokusebenza okunamandla kakhulu kwamahora angu-8 okuqhubekayo, ushintsho lobukhulu besisekelo se-ZHHIMG lwalungaphansi kuka-0.1μm, okuqinisekisa ukulawulwa okunembile kokucindezela kokubopha i-die kanye nokuphakama ukuvimbela umonakalo we-chip noma ukusonta okubi okubangelwa ukuguqulwa kokushisa. Idatha evela efektri yokupakisha ye-LED yaseTaiwan ikhombisa ukuthi ngemuva kokusebenzisa isisekelo se-ZHHIMG, izinga lokukhubazeka kokubopha i-die lehle lisuka ku-3.2% laya ku-1.1%, okusindisa izindleko ezingaphezu kwezigidi eziyi-10 zama-yuan ngonyaka.
Izici zokudambisa okuphezulu: Susa ukuphazamiseka kokudlidliza
Ukudlidliza okungu-20-50Hz okubangelwa ukunyakaza kwejubane eliphezulu kwekhanda le-die die, uma kungancishiswanga ngesikhathi, kuzothinta ukunemba kokubekwa kwe-chip. Isakhiwo sangaphakathi sekristalu se-ZHHIMG siyinika ukusebenza okuhle kakhulu kokudambisa, ngesilinganiso sokudambisa esingu-0.05 kuya ku-0.1, okuphindwe ka-5 kuya ku-10 kunezinto zensimbi. Njengoba kuqinisekiswe yi-ANSYS simulation, kunganciphisa ubukhulu bokudlidliza ngaphezu kuka-90% ngaphakathi kwemizuzwana engu-0.3, kuqinisekisa ngempumelelo ukuzinza kwenqubo yokubopha i-die, okwenza iphutha le-chip bonding Angle libe ngaphansi kuka-0.5°, futhi kuhlangabezane nezidingo eziqinile zama-chip e-LED ngezinga lokuthambekela.
Ukuqina kwamakhemikhali: Kuvumelana nezimo zokukhiqiza ezinzima
Ezindaweni zokupakisha ze-LED, amakhemikhali anjenge-fluxes kanye nama-agent okuhlanza avame ukusetshenziswa. Izinto eziyisisekelo ezijwayelekile zivame ukugqwala, okungathinta ukunemba kwazo. I-ZHHIMG yakhiwe ngamaminerali anjenge-quartz ne-feldspar. Inezakhiwo zamakhemikhali ezizinzile kanye nokumelana okuhle kakhulu nokugqwala kwe-asidi kanye ne-alkali. Akukho ukusabela kwamakhemikhali okusobala ngaphakathi kobubanzi be-pH obungu-1 kuya ku-14. Ukusetshenziswa kwesikhathi eside ngeke kubangele ukungcoliswa kwe-ion yensimbi, kuqinisekisa ukuhlanzeka kwendawo yokubopha idayi futhi kuhlangabezana nezidingo zezindinganiso ze-ISO 14644-1 Class 7 cleanroom, okunikeza isiqinisekiso sokupakisha kwe-LED okuthembekile kakhulu.
Amandla okucubungula ngokunemba: Finyelela ukuhlanganiswa okunembe kakhulu
Ithembele kubuchwepheshe bokucubungula obunembile kakhulu, i-ZHHIMG ingalawula ukuthamba kwesisekelo ngaphakathi kuka-±0.5μm/m kanye nobulukhuni bomphezulu i-Ra≤0.05μm, inikeze izinkomba zokufaka ezinembile zezingxenye ezinembile njengezinhloko ze-die bonding kanye nezinhlelo zokubona. Ngokuhlanganisa okungenamthungo neziqondiso eziqondile eziqondile (ukunemba kokuphinda ukubeka ±0.3μm) kanye ne-laser rangefinders (isixazululo esingu-0.1μm), ukunemba kokubeka okuphelele kwemishini ye-die bonding kuphakanyiswe ezingeni eliphambili embonini, okwenza kube lula ukuthuthuka kwezobuchwepheshe kwamabhizinisi e-LED ensimini ye-LED.
Esikhathini samanje sokuthuthukiswa okusheshayo embonini ye-LED, i-ZHHIMG, isebenzisa izinzuzo zayo ezimbili ekusebenzeni kwezinto ezibonakalayo kanye nezinqubo zokukhiqiza, inikeza izixazululo eziyisisekelo zokunemba ezizinzile nezithembekile zemishini yokubopha i-die, ikhuthaza ukupakishwa kwe-LED kube ukunemba okuphezulu kanye nokusebenza kahle, futhi isibe yimbangela ebalulekile yokuphindaphinda kobuchwepheshe embonini.
Isikhathi sokuthunyelwe: Meyi-21-2025