Kugagasi lokuthuthukela kwemboni ye-LED kubuchwepheshe be-LED, ukunemba kwemishini ye-die bonding kunquma ngokuqondile isivuno sokupakishwa kwe-chip nokusebenza komkhiqizo. I-ZHHIMG, ngokuhlanganiswa kwayo okujulile kwesayensi yezinto zokwakha kanye nokukhiqizwa okunembayo, inikeza ukwesekwa okubalulekile kwemishini ye-LED die bonding futhi isibe amandla abalulekile aqhuba ukusungulwa kwezobuchwepheshe embonini.
Ukuqina okuphezulu nokuqina: Ukuqinisekisa ukunemba kwe-micron-die bonding
Inqubo ye-die bonding yamaledi idinga ukubopha okunembile kwama-chips angama-micron (onosayizi omncane ofinyelela ku-50μm×50μm) ku-substrate. Noma yikuphi ukuguqulwa kwesisekelo kungase kubangele ukushintsha kwe-die bonding. Ukuminyana kwezinto ze-ZHHIMG kufinyelela ku-2.7-3.1g/cm³, futhi amandla ayo okucindezela adlula u-200MPa. Ngesikhathi sokusebenza kwemishini, ingamelana ngokuphumelelayo nokudlidliza kanye nokushaqeka okukhiqizwa ukunyakaza kwe-high-frequency yekhanda le-die bonding (kufika izikhathi ezingu-2000 ngomzuzu). Isilinganiso sangempela sebhizinisi le-LED ehamba phambili sibonisa ukuthi okokusebenza kwe-die bonding esebenzisa isisekelo se-ZHHIMG kungalawula i-chip offset ngaphakathi kuka-±15μm, ephakeme ngo-40% kunaleyo yemishini eyisisekelo yendabuko futhi ihlangabezana ngokugcwele nezimfuneko eziqinile zezinga le-JEDEC J-STD-020D lokunemba kwe-die bonding.
Ukuzinza kwe-thermal okuvelele: Ukubhekana nenselele yokukhuphuka kwezinga lokushisa kwemishini
Ukusebenza kwesikhathi eside kwemishini ye-die bonding kungabangela ukukhuphuka kwezinga lokushisa lasendaweni (kufika ngaphezu kuka-50℃), futhi ukwanda okushisayo kwezinto ezivamile kungase kushintshe ukuma okuhlobene phakathi kwekhanda le-die bonding kanye ne-substrate. I-coefficient yokunwetshwa okushisayo kwe-ZHHIMG iphansi njengo-(4-8) ×10⁻⁶/℃, okuyingxenye kuphela yensimbi ekhonjiwe. Ngesikhathi sokusebenza okuqhubekayo kwamahora angu-8, ukuguqulwa kobukhulu besisekelo se-ZHHIMG bekungaphansi kuka-0.1μm, okuqinisekisa ukulawulwa okunembile kwengcindezi ye-die bonding kanye nokuphakama ukuvimbela ukulimala kwe-chip noma ukusoda okungekuhle okubangelwa ukuwohloka kokushisa. Idatha evela efekthri yokupakisha ye-Taiwanese LED ibonisa ukuthi ngemva kokusebenzisa isisekelo se-ZHHIMG, izinga lokukhubazeka kwe-die bonding lehla lisuka ku-3.2% laya ku-1.1%, konga izindleko ezingaphezu kwezigidi ezingu-10 zamayuan ngonyaka.
Izici zokudambisa okuphezulu: Susa ukuphazamiseka kokudlidliza
Ukudlidliza okungu-20-50Hz okukhiqizwa ukunyakaza kwejubane eliphezulu kwekhanda le-die die, uma kungancishiswa ngesikhathi, kuzothinta ukunemba kokubekwa kwe-chip. Isakhiwo sekristalu sangaphakathi se-ZHHIMG siyinikeza ukusebenza okuhle kakhulu kokufiphala, ngesilinganiso sokuswakama esingu-0.05 kuya ku-0.1, okuyizikhathi eziphindwe ka-5 kuye kweziyi-10 kunezensimbi. Kuqinisekiswe ukulingiswa kwe-ANSYS, kunganciphisa i-amplitude yokudlidliza ngaphezu kuka-90% phakathi kwamasekhondi angu-0.3, iqinisekise ngempumelelo ukuqina kwenqubo ye-die bonding, yenze iphutha le-chip bonding Angle libe ngaphansi kuka-0.5°, futhi ihlangabezane nezidingo eziqinile zama-chips e-LED wedigri yokutsheka.
Ukuzinza kwamakhemikhali: Kuvumelana nezimo zokukhiqiza ezinokhahlo
Ezingxoxweni zokupakisha ze-LED, amakhemikhali afana nama-fluxes nama-ejenti okuhlanza avame ukusetshenziswa. Izinto eziyisisekelo ezijwayelekile zijwayele ukugqwala, ezingathinta ukunemba kwazo. I-ZHHIMG yakhiwe ngamaminerali afana ne-quartz ne-feldspar. Inezindawo zamakhemikhali ezizinzile futhi imelana kahle kakhulu ne-asidi nokugqwala kwe-alkali. Akukho ukusabela kwamakhemikhali okusobala phakathi kwebanga le-pH lika-1 kuya ku-14. Ukusetshenziswa isikhathi eside ngeke kubangele ukungcoliswa kwe-ion yensimbi, kuqinisekisa ukuhlanzeka kwendawo yokubopha i-die bonding kanye nokuhlangabezana nezidingo ze-ISO 14644-1 Class 7 amazinga wegumbi lokuhlanza, okunikeza isiqinisekiso sokuthembeka okuphezulu kwamaphakeji e-LED.
Amandla okucubungula okunembayo: Finyelela ukuhlanganisa okunembe kakhulu
Ithembele kubuchwepheshe bokucubungula obunembayo kakhulu, i-ZHHIMG ingakwazi ukulawula ukucaba kwesisekelo phakathi kuka-±0.5μm/m kanye nobuhwaba obungaphezulu obungu-Ra≤0.05μm, inikeze izinkomba zokufaka ezinembayo zezingxenye ezinembayo njengamakhanda e-die bonding nezinhlelo zokubona. Ngokuhlanganisa okungenamthungo neziqondiso zomugqa ezinembayo (ukunemba kokubeka okuphindaphindayo ±0.3μm) kanye ne-laser rangefinders (ukulungiswa okungu-0.1μm), ukunemba sekukonke kokuma kwemishini ye-die bonding kukhushulelwe ezingeni elihamba phambili embonini, okwenza kube lula ukuthuthuka kwezobuchwepheshe kumabhizinisi embonini ye-LED.
Esikhathini samanje sokuthuthukiswa okusheshayo embonini ye-LED, i-ZHHIMG, isebenzisa izinzuzo zayo ezimbili ekusebenzeni kwezinto ezibonakalayo kanye nezinqubo zokukhiqiza, inikeza izixazululo ezizinzile nezithembekile zesisekelo semishini yokubopha i-die, ukukhuthaza ukupakishwa kwe-LED ekuqondeni okuphezulu nokusebenza kahle, futhi isibe amandla ayinhloko okushayela ukuphindaphinda kwezobuchwepheshe embonini.
Isikhathi sokuthumela: May-21-2025