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Emkhakheni wokukhiqiza ama-semiconductor, ukunemba kwemishini yokuhlola i-wafer kunquma ngokuqondile ikhwalithi kanye nesivuno sama-chips. Njengesisekelo esisekela izingxenye zokutholwa okuyinhloko, ukuzinza kobukhulu besisekelo sempahla kudlala indima ebalulekile ekusebenzeni kwesikhathi eside kwesisetshenziswa. I-Granite ne-cast iron yizinto ezimbili eziyisisekelo ezivame ukusetshenziswa zemishini yokuhlola i-wafer. Ucwaningo lokuqhathanisa lweminyaka eyi-10 luveze umehluko obalulekile phakathi kwazo mayelana nokuzinza kobukhulu, okuhlinzeka ngezinkomba ezibalulekile zokukhethwa kwemishini. .
Ingemuva Lokuhlola Nomklamo
Inqubo yokukhiqiza yama-wafers e-semiconductor inezidingo eziphakeme kakhulu zokuthola ukunemba. Ngisho nokuchezuka kobukhulu bezinga le-micrometer kungaholela ekwehleni kokusebenza kwe-chip noma ngisho nokulahlwa. Ukuhlola ukuzinza kwe-dimensional kwe-granite ne-cast iron ngesikhathi sokusetshenziswa kwesikhathi eside, ithimba locwaningo lidizayine ukuhlola okulingisa izindawo zokusebenza zangempela. Amasampula e-Granite nensimbi ecijile encazelo efanayo akhethwa futhi afakwa ekamelweni lemvelo lapho izinga lokushisa laliguquguquka lisuka ku-15℃ laya ku-35℃ futhi umswakama uguquguquka ukusuka ku-30% ukuya ku-70% RH. Ukudlidliza komshini ngesikhathi sokusebenza kwesisetshenziswa kwalingiswa ngetafula lokudlidliza. Ubukhulu obuyinhloko bamasampuli balinganiswa njalo ngekota kusetshenziswa i-interferometer ye-laser enembe kakhulu, futhi idatha yarekhodwa ngokuqhubekayo iminyaka eyi-10. .
Umphumela wokuhlola: Inzuzo ephelele yegwadle
Iminyaka eyishumi yedatha yokuhlola ibonisa ukuthi i-granite substrate ibonisa ukuzinza okumangalisayo. I-coefficient yayo yokunwetshwa kwe-thermal iphansi kakhulu, isilinganiso esingu-4.6×10⁻⁶/℃ kuphela. Ngaphansi kokushintsha kwezinga lokushisa okunamandla, ukuchezuka kwe-dimensional kuhlala kulawulwa ngaphakathi kuka-±0.001mm. Ebusweni bezinguquko zomswakama, ukwakheka okuminyene kwegwadle kuyenza icishe ingathinteki, futhi azikho izinguquko ezilinganisekayo zobukhulu ezenzekayo. Endaweni yokudlidliza komshini, izici ezinhle kakhulu zokudambisa zegwadle zimunca ngempumelelo amandla okudlidliza, futhi ukushintshashintsha kobukhulu kuncane kakhulu. .
Ngokuphambene, ku-cast iron substrate, i-coefficient yayo evamile yokwandisa okushisayo ifinyelela ku-11×10⁶/℃ - 13×10⁻⁶/℃, futhi ukuchezuka kobukhulu obukhulu okubangelwa ukushintsha kwezinga lokushisa phakathi neminyaka eyi-10 ngu-±0.05mm. Endaweni enomswakama, insimbi ekhonjiwe ijwayele ukugqwala nokugqwala. Amanye amasampula abonisa ukuwohloka kwendawo, futhi ukuchezuka kobukhulu kuyanda. Ngaphansi kwesenzo sokudlidliza komshini, insimbi ekhonjiwe inokusebenza okungenamandla kokudambisa ukudlidliza futhi usayizi wayo ushintshashintsha njalo, okwenza kube nzima ukuhlangabezana nezidingo zokunemba okuphezulu zokuhlolwa kwe-wafer. .
Isizathu esibalulekile somehluko ekuzinzeni
I-Granite yakhiwa ngaphezu kwamakhulu ezigidi zeminyaka ngokusebenzisa izinqubo ze-geological. Isakhiwo sayo sangaphakathi siminyene futhi sifana, futhi amakristalu amaminerali ahlelwe ngokuzinzile, aqeda ukucindezeleka kwangaphakathi ngokwemvelo. Lokhu kuyenza ingazweli kakhulu izinguquko ezicini zangaphandle ezifana nezinga lokushisa, umswakama kanye nokudlidliza. I-Cast iron yenziwe ngenqubo yokulingisa futhi inokukhubazeka okuncane okufana nezimbotshana nezimbobo zesihlabathi ngaphakathi. Phakathi naleso sikhathi, ukucindezeleka okuyinsalela okukhiqizwa ngesikhathi sokuphonsa kuthambekele ekubangeleni izinguquko ezinobukhulu ngaphansi kokukhuthazwa kwendawo yangaphandle. Izakhiwo zensimbi ezisansimbi ziyenza ijwayele ukugqwala ngenxa yomswakama, isheshisa ukulimala kwesakhiwo kanye nokunciphisa ukuzinza kwe-dimensional. .
Umthelela kumishini yokuhlola i-wafer
Imishini yokuhlola i-wafer esekelwe ku-granite substrate, ngokusebenza kwayo kobukhulu obuzinzile, ingaqinisekisa ukuthi isistimu yokuhlola igcina ukunemba okuphezulu isikhathi eside, inciphise ukuhlulela kabi nokutholwa okugejiwe okubangelwa ukukhukhuleka kokunemba kwemishini, futhi ithuthukise ngokuphawulekayo isivuno somkhiqizo. Ngaleso sikhathi, izidingo zokulungisa eziphansi zinciphisa izindleko ezigcwele zomjikelezo wempilo wemishini. Izisetshenziswa ezisebenzisa i-cast iron substrates, ngenxa yokungaqini kahle kwe-dimensional, zidinga ukulinganisa nokugcinwa njalo. Lokhu akukhulisi nje kuphela izindleko zokusebenza kodwa kungase kuthinte ikhwalithi yokukhiqizwa kwe-semiconductor ngenxa yokunemba okunganele, okubangela ukulahlekelwa kwezomnotho okungaba khona. .
Ngaphansi kokuthambekela kokuphishekela kwemboni ye-semiconductor yokunemba okuphezulu nekhwalithi engcono, ukukhetha i-granite njengento eyisisekelo yemishini yokuhlola i-wafer ngokungangabazeki kuyisinyathelo esihlakaniphile sokuqinisekisa ukusebenza kwemishini nokuthuthukisa ukuncintisana kwamabhizinisi. .
Isikhathi sokuthumela: May-14-2025