Ngaphansi kwezidingo eziqinile zokunemba okuphezulu nokuthembeka okuphezulu embonini ye-semiconductor, nakuba i-granite ingenye yezinto eziyinhloko, izakhiwo zayo nazo ziletha ukulinganiselwa okuthile. Okulandelayo ukuntula kwayo okuyinhloko nezinselele ekusetshenzisweni okungokoqobo:
Okokuqala, i-material i-brittle kakhulu futhi kunzima ukuyicubungula
Ingozi yokuqhekeka: I-Granite empeleni iyitshe lemvelo elinemifantu emincane yemvelo kanye nemingcele yezinhlayiya zamaminerali ngaphakathi, futhi iyinto evamile ephukayo. Emashini anembe kakhulu (njengokugaya i-nanoscale kanye nokucubungula indawo egobile eyinkimbinkimbi), uma amandla engalingani noma imingcele yokucubungula ingafaneleki, izinkinga ezifana nokuqhekeka nokusakazwa kwe-microcrack zijwayele ukwenzeka, okuholela ekuchithweni kocwecwe lokusebenza.
Ukusebenza kahle kokucubungula okuphansi: Ukuze ugweme ukuphuka okungama-brittle, izinqubo ezikhethekile ezifana nokugaya ngesivinini esiphansi ngamasondo okugaya idayimane kanye nokupholisha kwe-magnetorheological kuyadingeka. Umjikelezo wokucubungula umude ngo-30% kuya ku-50% kunalowo wezinto zensimbi, futhi izindleko zokutshalwa kwezimali zemishini ziphezulu (isibonelo, intengo yesikhungo sokuhlanganisa ama-axis amahlanu idlula amayuan ayizigidi ezingu-10).
Imikhawulo yesakhiwo esiyinkimbinkimbi: Kunzima ukukhiqiza izakhiwo ezingenalutho ezingasindi ngokusakaza, ukufoja nezinye izinqubo. Isetshenziswa kakhulu kumajamo wejiyomethri alula njengamapuleti nezisekelo, futhi ukusetshenziswa kwayo kunomkhawulo kumishini edinga ukusekela okungajwayelekile noma ukuhlanganiswa kwamapayipi angaphakathi.
Okwesibili, ukuminyana okuphezulu kuholela kumthwalo osindayo emishinini
Kunzima ukuyiphatha nokuyifaka: Ukuminyana kwegwadle cishe ku-2.6-3.0 g/cm³, futhi isisindo sayo siphindwe izikhathi ezingu-1.5-2 kunesansimbi ecijile ngaphansi kwevolumu efanayo. Isibonelo, isisindo sesisekelo se-granite somshini we-photolithography singafinyelela kumathani angu-5 kuya kwangu-10, okudinga imishini yokuphakamisa ezinikele kanye nesisekelo sobufakazi bokushaqeka, okwandisa izindleko zokwakhiwa kwefekthri nokuthunyelwa kwemishini.
I-Dynamic response lag: Inertia ephezulu ikhawulela ukusheshisa kwezingxenye ezihambayo zemishini (njengamarobhothi adlulisa ama-wafer). Ezimeni lapho kudingeka khona ukuqala nokuma ngokushesha (njengemishini yokuhlola enesivinini esikhulu), kungase kuthinte isigqi sokukhiqiza futhi kunciphise ukusebenza kahle.
Okwesithathu, izindleko zokulungisa nokuphindaphinda ziphezulu
Kunzima ukukulungisa: Uma ukuguga okungaphezulu noma ukulimala kokushayisana kwenzeka ngesikhathi sokusetshenziswa, kudinga ukubuyiselwa efekthri ukuze kulungiswe kusetshenziswa okokusebenza okuphrofeshinali, okungakwazi ukusingathwa ngokushesha esizeni. Ngokuphambene, izakhi zensimbi zingalungiswa ngokushesha ngokusebenzisa izindlela ezifana nokushisela indawo kanye ne-laser cladding, okuholela ekunciphiseni isikhathi sokuphumula.
Umjikelezo wokuphindaphinda kwedizayini mude: Umehluko emithanjeni yegwadle yemvelo ungase ubangele ukushintshashintsha okuncane kuzakhiwo zento ezibonakalayo (ezifana ne-coefficient yokunweba okushisayo kanye nesilinganiso sokumanzisa) kwamaqoqo ahlukene. Uma idizayini yesisetshenziswa ishintsha, izinto ezibonakalayo zidinga ukuphinda zifaniswe, futhi umjikelezo wokuqinisekisa ucwaningo nokuthuthukiswa mude uma kuqhathaniswa.
Iv. Izinsiza Ezinomkhawulo kanye Nezinselele Zemvelo
Amatshe emvelo awavuseleleki: Igwadule lekhwalithi ephezulu (elifana ne-"Jinan Green" kanye ne-"Sesame Black" elisetshenziswa kuma-semiconductors) lithembele emithanjeni ethile, linezinqolobane ezilinganiselwe futhi ukumbiwa kwalo kuvinjelwe izinqubomgomo zokuvikela imvelo. Ngokunwetshwa kwemboni ye-semiconductor, kungase kube nobungozi bokunikezwa kwezinto ezingavuthiwe okungazinzile.
Ukucubungula izindaba zokungcola: Phakathi nezinqubo zokusika nokugaya, inani elikhulu lothuli lwegwadle (eliqukethe i-silicon dioxide) liyakhiqizwa. Uma ingaphathwa kahle, ingabangela i-silicosis. Ngaphezu kwalokho, amanzi angcolile adinga ukuphathwa nge-sedimentation ngaphambi kokuthi akhishwe, okwandisa ukutshalwa kwezimali kokuvikela imvelo.
Ezinhlanu. Ukungahambelani okwanele nezinqubo ezivelayo
Imikhawulo yemvelo ye-vacuum: Ezinye izinqubo ze-semiconductor (ezifana ne-vacuum coating kanye ne-electron beam lithography) zidinga ukugcinwa kwesimo se-vacuum esiphezulu ngaphakathi kwempahla. Kodwa-ke, ama-micro-pores angaphezulu kwe-granite angase adsorbe ama-molecule egesi, akhululwa kancane futhi athinte ukuqina kwedigri ye-vacuum. Ngakho-ke, ukwelashwa okwengeziwe kokuqina kwendawo (njengokufakwa kwe-resin) kuyadingeka.
Izinkinga zokuhambisana kwe-Electromagnetic: I-Granite iyinto evikelayo. Ezimeni lapho kudingeka ukukhishwa kukagesi omile noma ukuvikela ugesi kagesi (ezifana nezinkundla ze-wafer electrostatic adsorption), izimbotshana zensimbi noma amafilimu e-conductive kudingeka ahlanganiswe, okwandisa ubunkimbinkimbi besakhiwo kanye nezindleko.
Isu lokuphendula lemboni
Ngaphandle kwalezi ziphambeko ezibalulwe ngenhla, imboni ye-semiconductor ikwenzele ukungaphumeleli kwe-granite ngokusungula izinto ezintsha zobuchwepheshe:
Idizayini yesakhiwo esiyinhlanganisela: Yamukela inhlanganisela ye "granite base + ifreyimu yensimbi", kucatshangelwa kokubili ukuqina nokungasindi (ngokwesibonelo, umenzi othile womshini we-photolithography ushumeka isakhiwo sezinyosi se-aluminium ingxubevange esisekelweni segwadle, sinciphisa isisindo ngo-40%).
Ezinye izinto zokwenziwa zokwenziwa: Dala izinhlanganisela ze-ceramic matrix (njenge-silicon carbide ceramics) namatshe okwenziwa asuselwa ku-epoxy resin ukuze alingise ukuqina okushisayo nokumelana nokudlidliza kwegwadle, kuyilapho uthuthukisa ukuguquguquka kokusebenza.
Ubuchwepheshe bokucubungula obuhlakaniphile: Ngokwethula ama-algorithms e-AI ukuze kuthuthukiswe indlela yokucubungula, ukulingisa ingcindezi ukuze ubikezele ubungozi bokuqhekeka, kanye nokuhlanganisa ukutholwa ku-inthanethi ukuze ulungise amapharamitha ngesikhathi sangempela, izinga lokucubungula i-scrap lehlisiwe lisuka ku-5% laya ngaphansi kuka-1%.
Isifinyezo
Ukushiyeka kwe-granite embonini ye-semiconductor empeleni kusuka kugeyimu phakathi kwezakhiwo zayo zemvelo kanye nezidingo zezimboni. Ngokuthuthuka kobuchwepheshe nokuthuthukiswa kwezinye izinto zokwakha, izimo zokusetshenziswa kwayo zingase zinciphe kancane kancane ziye “ezingxenyeni zereferensi ezingenakuthathelwa indawo indawo” (njengama-hydrostatic guide rails emishini ye-photolithography kanye nezinkundla zokulinganisa ezinembe kakhulu), kuyilapho kancane kancane zidedela izinto zobunjiniyela eziguquguqukayo ezingxenyeni ezingabalulekile zesakhiwo. Ngokuzayo, indlela yokulinganisa ukusebenza, izindleko kanye nokusimama kuzoba yisihloko imboni eqhubeka ukuyihlola.
Isikhathi sokuthumela: May-24-2025