Namuhla, ngokuthuthuka okusheshayo kwemboni ye-semiconductor, ukuhlolwa kwe-IC, njengesixhumanisi esibalulekile sokuqinisekisa ukusebenza kwama-chips, ukunemba kwawo kanye nokuzinza kuthinta ngqo izinga lokukhiqiza lama-chips kanye nokuncintisana kwemboni. Njengoba inqubo yokukhiqiza ama-chip iqhubeka nokuthuthukela ku-3nm, 2nm kanye nama-node athuthuke kakhulu, izidingo zezingxenye ezibalulekile kumishini yokuhlola i-IC ziya ngokuya ziba lukhuni. Izisekelo ze-granite, ezinempahla yazo ehlukile kanye nezinzuzo zokusebenza, seziphenduke "uzakwethu wegolide" obalulekile wemishini yokuhlola i-IC. Iyiphi ingqondo yobuchwepheshe elele ngemuva kwalokhu?
I. "Ukungakwazi Ukubhekana Nezimo" Zezisekelo Zendabuko
Phakathi nenqubo yokuhlola i-IC, okokusebenza kudinga ukubona ngokunembile ukusebenza kukagesi kwezikhonkwane ze-chip, ubuqotho besignali, njll. ku-nanoscale. Kodwa-ke, izisekelo zensimbi zendabuko (njengensimbi ekhonjiwe nensimbi) ziveze izinkinga eziningi ekusebenzeni okungokoqobo.
Ngakolunye uhlangothi, i-coefficient yokunwetshwa okushisayo kwezinto zensimbi iphakeme kakhulu, ngokuvamile ingaphezu kuka-10×10⁻⁶/℃. Ukushisa okukhiqizwa ngesikhathi sokusebenza kwemishini yokuhlola i-IC noma izinguquko ezincane kuzinga lokushisa elizungezile kungabangela ukunwetshwa okuphawulekayo kokushisa kanye nokufinyela kwesisekelo sensimbi. Isibonelo, isisekelo sensimbi esiyimitha elingu-1 ubude singanwetshwa futhi sinciphe kufika ku-100μm lapho izinga lokushisa lishintsha ngo-10℃. Izinguquko zobukhulu ezinjalo zanele ukumisa kabi i-probe yokuhlola namaphinikhodi, okuholela ekuthintwaneni okubi futhi okubangele ukuhlanekezelwa kwedatha yokuhlola.
Ngakolunye uhlangothi, ukusebenza kokudambisa kwesisekelo sensimbi kubi, okwenza kube nzima ukusebenzisa ngokushesha amandla okudlidliza akhiqizwa ukusebenza kwemishini. Esimeni sokuhlolwa kwesignali yemvamisa ephezulu, i-micro-oscillation eqhubekayo izokwethula inani elikhulu lomsindo, ikhulise iphutha lokuhlolwa kobuqotho besignali ngaphezu kwama-30%. Ngaphezu kwalokho, izinto zensimbi zinokuthambekela okuphakeme kazibuthe futhi zijwayele ukuhlangana nezimpawu zikagesi zemishini yokuhlola, okuholela ekulahlekelweni kwamanje kwe-eddy kanye nemiphumela ye-hysteresis, ephazamisa ukunemba kwezilinganiso ezinembile.
Ii. "I-Hardcore Strength" yezisekelo zeGranite
Ukuqina kokushisa okuphezulu, ukubeka isisekelo sokulinganisa okunembile
I-Granite yakhiwa inhlanganisela eqinile yamakristalu amaminerali afana ne-quartz ne-feldspar ngokusebenzisa i-ionic ne-covalent bond. I-coefficient yayo yokunwetshwa kwe-thermal iphansi kakhulu, kuphela i-0.6-5×10⁻⁶/℃, ecishe ibe ngu-1/2-1/20 yaleyo yezinto zensimbi. Ngisho noma izinga lokushisa lishintsha ngo-10℃, ukunwetshwa nokufinyezwa kwesisekelo segwadle esingamamitha angu-1 ubude kungaphansi kuka-50nm, kucishe kuzuze "zero deformation". Phakathi naleso sikhathi, ukushisa kwegwadle kungu-2-3 W/(m · K) kuphela, okungaphansi kwe-1/20 yaleyo yezinsimbi. Ingakwazi ukuvimbela ngokuphumelelayo ukuqhutshwa kokushisa kwemishini, igcine izinga lokushisa elingaphezulu leyunifomu yesisekelo, futhi iqinisekise ukuthi i-probe yokuhlola kanye ne-chip kugcina isimo esihlobene ngaso sonke isikhathi.
2. Ukucindezela kokudlidliza okunamandla kakhulu kudala indawo yokuhlola ezinzile
Amaphutha ekristalu ayingqayizivele kanye nesakhiwo sokuslayida somngcele wokusanhlamvu ngaphakathi kwegranite kuyinikeza amandla aqinile wokulahla amandla, ngesilinganiso sokuswakama esifika ku-0.3-0.5, esiphindwe izikhathi ezingaphezu kweziyisithupha kunesisekelo sensimbi. Idatha yokuhlola ibonisa ukuthi ngaphansi kwesasasa lokudlidliza elingu-100Hz, isikhathi sokudlidliza sesisekelo segwadle singamasekhondi angu-0.1 kuphela, kuyilapho leso sesisekelo sensimbi eyi-cast singamasekhondi angu-0.8. Lokhu kusho ukuthi isisekelo se-granite singacindezela ngokushesha ukudlidliza okubangelwa ukuqalisa nokuvalwa kwemishini, imithelela yangaphandle, njll., futhi silawule ukuphakama kokudlidliza kweplathifomu yokuhlola phakathi kuka-±1μm, inikeze isiqinisekiso esizinzile sokuma kwama-nanoscale probe.
3. Izakhiwo zemvelo ezilwa nozibuthe, eziqeda ukuphazanyiswa kwe-electromagnetic
I-Granite iwumsebenzi we-diamagnetic onokuthinteka kazibuthe cishe -10 ⁻⁵. Ama-electron angaphakathi akhona ngamabili ngaphakathi kwamabhondi amakhemikhali futhi cishe awahlukanisi amandla kazibuthe angaphandle. Endaweni eqinile kazibuthe engu-10mT, amandla kazibuthe akhangisiwe endaweni yegwadle angaphansi kuka-0.001mT, kuyilapho lokho okungaphezulu kwensimbi ewuketshezi kuphezulu ngaphezu kuka-8mT. Lesi sakhiwo semvelo esilwa nozibuthe singakha indawo yokulinganisa emsulwa yemishini yokuhlola i-IC, iyivikele ekuphazamisekeni kwangaphandle kozibuthe okufana nezinjini zokusebenzela kanye namasiginali e-RF. Ifaneleka ngokukhethekile ukuhlola izimo ezizwela kakhulu kumsindo kazibuthe, njengama-quantum chips nama-ADC/Dacs anembe kakhulu.
Okwesithathu, ukusetshenziswa okusebenzayo kuzuze imiphumela emangalisayo
Imikhuba yamabhizinisi amaningi e-semiconductor ilibonise ngokugcwele inani lezisekelo ze-granite. Ngemva kokuba umkhiqizi wemishini yokuhlola i-semiconductor edume emhlabeni wonke ethole isisekelo se-granite endaweni yayo yokuhlola i-chip ye-5G ephezulu, ithole imiphumela emangalisayo: ukunemba kokuma kwekhadi lophenyo kukhuphuke ukusuka ku-±5μm ukuya ku-±1μm, ukuchezuka okujwayelekile kwedatha yokuhlola kwehle ngo-70%, futhi izinga lokwahlulela ngokungalungile lehle ngo-3.0% ngokuphawulekayo. Ngaleso sikhathi, umphumela wokucindezela ukudlidliza uyamangalisa. Okokusebenza kungaqala ukuhlolwa ngaphandle kokulinda ukudlidliza ukuthi kubole, kufinyeze umjikelezo wokuhlola owodwa ngo-20% futhi kwandise umthamo wokukhiqiza wonyaka ngamawafa angaphezu kwezigidi ezi-3. Ngaphezu kwalokho, isisekelo se-granite siphila iminyaka engaphezu kwe-10 futhi ayidingi ukulungiswa njalo. Uma kuqhathaniswa nezisekelo zensimbi, izindleko zayo zizonke zehliswa ngaphezu kuka-50%.
Okwesine, ukuzivumelanisa nezimo zezimboni futhi uhole ekuthuthukisweni kobuchwepheshe bokuhlola
Ngokuthuthukiswa kobuchwepheshe bokupakisha obuthuthukisiwe (obufana ne-Chiplet) kanye nokukhula kwezinkambu ezisafufusa njengama-quantum computing chips, izimfuneko zokusebenza kwedivayisi ekuhlolweni kwe-IC zizoqhubeka zikhuphuka. Izisekelo ze-Granite nazo zihlala zisungula futhi zithuthukisa. Ngokwelashwa kokumboza okungaphezulu ukuze kuthuthukiswe ukumelana nokuguga noma ngokuhlanganisa nezitsha zobumba ze-piezoelectric ukuze kuzuzwe isinxephezelo sokudlidliza esisebenzayo nokunye ukuphumelela kwezobuchwepheshe, ziqhubekela phambili ekuqondeni okunembe kakhulu nokuhlakaniphe kakhudlwana. Ngokuzayo, isisekelo se-granite sizoqhubeka nokuvikela ukusungulwa kobuchwepheshe bemboni ye-semiconductor kanye nokuthuthukiswa kwekhwalithi ephezulu "ye-chips yaseShayina" nokusebenza kwayo okuvelele.
Ukukhetha isisekelo se-granite kusho ukukhetha isisombululo sokuhlola i-IC esinembe kakhudlwana, esizinzile nesisebenza kahle. Kungakhathaliseki ukuthi ukuhlolwa kwe-chip yenqubo ethuthukisiwe kwamanje noma ukuhlola okuzayo kobuchwepheshe obusezingeni eliphezulu, isisekelo segwadle sizodlala indima engenakushintshwa nebalulekile.
Isikhathi sokuthumela: May-15-2025