Kungani isisekelo se-Granite esingaphansi kwegesi sibalulekile esizukulwaneni esilandelayo sokukhiqizwa kwe-Vacuum-Based Semiconductor?

Ekulandeleni uMthetho kaMoore, imboni ye-semiconductor ifinyelele endaweni lapho ukunemba kwezinga le-athomu kuyindinganiso, hhayi okuhlukile. Njengoba siqhubekela phambili kuma-node enqubo amancane kakhulu, izindawo lapho kucutshungulwa khona ama-silicon wafers sezibe yizitha kakhulu ezintweni zobunjiniyela zendabuko. Ngokukhethekile, emakamelweni ane-vacuum ephezulu asetshenziselwa ukufakwa nokugqwala okuthuthukisiwe, ukukhetha isisekelo somshini akusasho nje isisindo nokuqina. Namuhla, ama-OEM ahamba phambili emhlabeni wonke abuza umbuzo obalulekile: izinto zezakhiwo zethu zangaphakathi zithinta kanjani ubuqotho be-vacuum uqobo? Yilapho ukuphakama kobuchwepheshe kwe-aisisekelo se-granite se-semiconductor esikhipha igesi ephansiuhlelo lokusebenza luba yinto echaza imboni.

Isenzakalo sokukhipha igesi ngaphandle—ukukhishwa kwamagesi avalelekile ezintweni eziqinile—singaba yinhlekelele endaweni evalekile. Ngisho nezinhlayiya ezincane noma ama-molecule egesi angangcolisa i-wafer, okuholela ekulahlekelweni okukhulu kwesivuno. Izinto ezihlanganisiwe zendabuko noma izinsimbi eziphathwe kahle zivame ukuba nzima ukuhlangabezana nezidingo eziqinile zokuhambisana ne-vacuum ephezulu. I-granite emnyama yemvelo, uma icutshungulwa ngokucophelela futhi ihlanzwa ochwepheshe, inikeza iphrofayili engasebenzi ngokwemvelo. Kwi-ZHHIMG Group, ukuqinisekisa ukuthi izingxenye zethu ze-granite zihlangabezana nalezi zindinganiso ze-vacuum ephansi kuhilela inqubo yokukhetha eyimfihlo lapho kukhethwa khona itshe elinobukhulu obuphezulu kakhulu, elinobukhulu obuphansi kakhulu ukuze kusetshenziswe ama-semiconductor. Lokhu kuqinisekisa ukuthi isikhathi sokubuyisa i-vacuum sincishisiwe futhi ubumsulwa bendawo yokucubungula buyagcinwa.

Ngale kobuqotho be-vacuum, indima yezisekelo zesakhiwo enqubweni ye-photolithography ibaluleke ngokulinganayo. Njengoba imithombo yokukhanya ishintshela ku-Extreme Ultraviolet (EUV), izinhlelo zokunyakaza ezithwala i-wafer kanye ne-reticle kumele zihambe ngezinga lokuvumelana elidlula imingcele yendabuko yemishini.isiteji se-granite somshini we-photolithographyinikeza indiza yokubhekisela enkulu, evidlizayo edingekayo kulokhu kunemba. Isisindo esingokwemvelo se-granite sisebenza njengesihlungi esidlula phansi, simunca ukudlidliza kwephansi okuvame kakhulu obekungakhuliswa yizinsika ezithambile ze-optical. Ngaphandle kwalesi sisekelo esisindayo nesizinzile, ukufeza ukunemba kokumbozwa kwe-sub-nanometer okudingekayo kuma-microchip anamuhla bekungeke kwenzeke ngokomzimba.

Ukuphathwa kokushisa kusalokhu kuyisithiyo esibalulekile ekwakhiweni kwe-semiconductor. Phakathi namahora okusebenza okuqhubekayo, ukushisa okukhiqizwa ama-motor aqondile asheshayo kungabangela ukwanda kokushisa esisekelweni somshini. Ngenkathi izinsimbi zanda futhi zincipha kakhulu ngokushintsha kwezinga lokushisa, i-granite ine-coefficient ephansi kakhulu yokwanda kokushisa. Lokhu kuzinza kobukhulu kuqinisekisa ukuthiisiteji se-granite somshini we-photolithographyihlala iphelele ngokwejiyometri ngisho nangemijikelezo yokukhiqiza eqinile. Lokhu kuthembeka kuvumela izikhawu ezinde phakathi kokulinganiswa, okuhumusha ngqo isikhathi esiphezulu sokusebenza kanye nenzuzo eyengeziwe yabaqhubi bezinto zokwakha ezifundeni ezifana neSilicon Valley kanye nezindawo ze-semiconductor zaseYurophu eDresden nase-Eindhoven.

Ipuleti Lokufaka I-Granite

I-ZHHIMG ibonile ukuthi ukuhlanganiswa kwalezi zingxenye kudinga ukuqonda okujulile kwezinqubo zokuhlanza. Akwanele ukunikeza itshe elinembile kakhulu; kumele libe "lilungele ukuhlanza." Lokhu kusho ukuthi i-granite kumele iphathwe ukuze kuvinjelwe noma yikuphi ukuchitheka kwezinhlayiya futhi kumele ihambisane nezinto zokuhlanza ezinamandla ezisetshenziswa ezindaweni ze-semiconductor. Ngokugxila ku-isisekelo se-granite se-semiconductor esikhipha igesi ephansiIsixazululo, i-ZHHIMG inikeza umkhiqizo ongeyona nje isakhiwo sokusekela, kodwa ingxenye ehlanganiswe ngokugcwele yesu lokulawula ukungcola. Le ndlela ephelele yobunjiniyela yiyo ehlukanisa umhlinzeki wezimboni ojwayelekile kumlingani we-semiconductor okhethekile.

Ngaphezu kwalokho, ubunzima bamathuluzi esimanje e-lithography budinga amajiyometri angaphakathi ayinkimbinkimbi ngaphakathi kwe-granite uqobo. Kusukela eziteshini zokuphatha izintambo eziyinkimbinkimbi kuya ezindaweni ezihlanganisiwe zokuthwala umoya, ukwenziwa kwe-aisiteji se-granite somshini we-photolithographykuhilela amakhulu amahora okusebenza ngokunemba okuphezulu kwe-CNC okulandelwa ukugoqa ngesandla ngokucophelela. Kwa-ZHHIMG, sifinyelela ukubekezela kobuso obuqinile kanye nokubekezelelana okuyisicaba okwakucatshangwa ukuthi akunakwenzeka ngamatshe emvelo. Lo mshado wezinto zasendulo kanye nobuchwepheshe besikhathi esizayo uyisisekelo lapho umhlaba wedijithali wakhelwe khona, usekela izinzwa, amaprosesa, kanye nama-memory chips anika amandla umnotho wethu womhlaba wonke.

Ekuphetheni, njengoba imboni ye-semiconductor iqhubeka nohambo lwayo olungapheli oluya enkathini ye-sub-1nm, ukubaluleka kwesisekelo sezinto ezibonakalayo akunakugcizelelwa. Umshini unamandla kuphela njengesisekelo omi kuso. Ngokubeka phambili i-aisisekelo se-granite se-semiconductor esikhipha igesi ephansiisisekelo kanye nokutshala imali ekhwalithini ephezulu kakhuluisiteji se-granite somshini we-photolithographyIzingxenye, abakhiqizi bemishini baqinisekisa ukuzinza nobumsulwa obudingekayo eminyakeni eyishumi ezayo yokusungula izinto ezintsha. I-ZHHIMG Group isalokhu izibophezele ekuphusheni imingcele yesayensi yezinto ezibonakalayo, iqinisekisa ukuthi isisekelo semboni ye-semiconductor sihlala siqinile futhi sinembile njengobuchwepheshe obusekelayo.


Isikhathi sokuthunyelwe: Mashi-03-2026