Kungani i-Natural Granite iyiSisekelo Esingabonakali Sokunemba Kwe-Nanoscale Emishinini Yokucubungula I-Wafer?

Ekufuneni okungapheli kwama-microchip amancane, asheshayo, futhi anamandla kakhulu, izidingo ezibekwe ku-Wafer Processing Equipment ziyanda ziye emazingeni okunemba okwakucatshangwa ukuthi awanakwenzeka ngaphambili. Njengoba izici zincipha ziye endaweni ye-nanometer enenombolo eyodwa, ukuzinza kwepulatifomu yonke yokukhiqiza kuba yinto ebalulekile. Kulapha, ngaphansi kohlu oluyinkimbinkimbi lwama-laser, amakamelo okuhlanza, kanye nezinhlelo zamarobhothi, lapho izinto zasendulo—i-granite yemvelo—zivela khona njengesici esibalulekile sempumelelo yesimanje ye-semiconductor. Imininingwane, ubunjiniyela, kanye nokuhlinzekwa kwezingxenye ze-granite ze-OEM ezinembayo ephezulu kanye nombhede womshini we-granite we-OEM we-monolithic akuzona nje izidingo zobuchwepheshe; ziyisisekelo sobuqotho bokusebenza.

Indima yesisekelo somshini kunoma yiluphi uhlelo olunembe kakhulu ukuhlinzeka ngendiza yokubhekisela engaguquki, ezinzile. Endaweni eguquguqukayo nebucayi yokwenziwa kwe-semiconductor, lapho kwenzeka khona izinqubo ezifana ne-lithography, i-etching, kanye ne-deposition, ukuphambuka okuncane—ngisho nasezingeni le-sub-micron—kungaholela ekulahlekelweni okukhulu kwesivuno. Ukukhethwa kwezinto zokwakha eziyinhloko, njengesisekelo somshini we-Wafer Processing Equipment, ngakho-ke kuyisinyathelo esingenakuxoxiswana ngaso ekwakhiweni.

Izinzuzo Ezingokwemvelo Ze-Natural Granite

Kungani i-granite yemvelo isebenza kangcono kunezinye izinto eziklanywe ngobunjiniyela njengensimbi ephothiwe, insimbi, noma ngisho nezinto ezithile ezihlanganisiwe kulolu hlelo lokusebenza olukhethekile? Impendulo itholakala ezicini zayo eziyingqayizivele, ezidala ngokwemvelo ezifanelekela ngokuphelele indawo engathetheleli yemishini yokunemba.

1. Ukudambisa Ukudlidliza Okungavamile (Ukuhlukaniswa Nezinqubo Zokusebenza):

Ukudlidliza kuyisitha sokukhiqizwa kwe-nanoscale. Kungakhathaliseki ukuthi kukhiqizwa ngaphakathi yizinjini nezingxenye ezihambayo noma ngaphandle kusuka phansi kwegumbi lokuhlanza, noma yikuphi ukudlidliza kumele kumuncwe ngokushesha. I-Granite ine-coefficient ephezulu kakhulu yokudambisa kwangaphakathi—ingcono kakhulu kunezinsimbi. Lesi sici sisho ukuthi amandla omshini asuswa ngokushesha njengokushisa, avimbele ukuzwakala futhi aqinisekise ukuthi izinqubo ezibalulekile zenziwa epulatifomu emile ngempela. Lokhu kubalulekile ekugcineni indawo eqondile ku-lithography ethuthukisiwe noma ukuqinisekisa ukususwa kwezinto ezifanayo ngesikhathi sokuhlelwa kwemishini yamakhemikhali (i-CMP).

2. Ukwanda Kokushisa Okuseduze Nokungenzi Nzuzo (Ukugcina Ubuqotho Bokuqondanisa):

Imishini Yokucubungula I-Wafer ivame ukubandakanya ukushintshashintsha kwezinga lokushisa, kokubili okuzungezile kanye nokubangelwa yinqubo. Izinto zensimbi ziyanda futhi zinciphe kakhulu ngokushintsha kwezinga lokushisa, okuholela ekukhukhuleni kokushisa kanye nokungahambisani kahle kwezinhlelo ze-optical noma ze-mechanical. I-Granite, ikakhulukazi i-granite emnyama, ibonisa i-coefficient ephansi kakhulu yokwanda kokushisa (CTE), cishe i-3×10⁻⁶/℃. Lokhu kuzinza kokushisa kuqinisekisa ukuthi ukunemba kobukhulu bombhede womshini we-granite kanye nezinye izingxenye ze-granite ze-OEM kuhlala kufana, kunciphisa amaphutha okushisa futhi kuqinisekisa ukuphindaphindwa kokulinganisa ngaphansi kwezimo ezahlukahlukene.

3. Ukuthamba Nokuqina Okuphelele:

Ngokusebenzisa amasu athuthukisiwe okugoqa nokupholisha, i-granite yemvelo ingafinyelela ukuthamba komphezulu okulinganiswa kuma-sub-micron—imfuneko ebalulekile yezindawo zokubhekisela ezisetshenziswa ekulawuleni ukunyakaza okunembile. Ngaphezu kwalokho, i-modulus yayo ephezulu ye-Young inikeza ukuqina okuguquguqukayo nokuguquguqukayo okungavamile. Lokhu kumelana nokuphambuka ngaphansi komthwalo kubalulekile, njengoba isisekelo kumele sisekele ama-motor amakhulu aqondile, izigaba, kanye nezakhiwo zokuhlanganisa ze-Wafer Processing Equipment eziyinkimbinkimbi ngaphandle kokuguquguquka okulinganiselwe, ngisho nangesikhathi eside.

Ubunjiniyela Bekusasa: Izingxenye ze-OEM Granite kanye ne-Complex Assembly

Ukusetshenziswa kwe-granite kwanamuhla kudlulela ngale kwamapuleti alula angaphezulu. Abakhiqizi bezobuchwepheshe obuphezulu banamuhla badinga izingxenye ze-granite ze-OEM eziyinkimbinkimbi, eziklanywe ngokwezifiso. Lokhu kungafaka phakathi imisele yokuqondisa ethwala umoya, ama-vacuum chucks ayinkimbinkimbi, izakhi zesiteji ezinama-axis amaningi, kanye namabhulokhi okufaka ama-laser nama-optics. Lezi zingcezu zivame ukwenziwa ngomshini ngezici zejiyometri eziyinkimbinkimbi, kufaka phakathi imigodi ebholiwe yokuqondisa izintambo, ukufakwa okunezintambo zokufaka, kanye nemisila noma izikhala ezifakwe ngomshini noma izinhlelo zokuthwala.

Inqubo yokwakha i-Wafer Processing Equipment assembly ephelele iqala ngombhede omkhulu womshini we-granite. Izingxenye ze-granite ezilandelayo zihlanganiswa noma zinamathiselwe kuwo kusetshenziswa ama-compounds asezingeni eliphezulu asekelwe ku-epoxy, isinyathelo esibalulekile esiqinisekisa ukuthi isakhiwo sonke sisebenza njengeyunithi eyodwa, efanayo. Ukuhlanganiswa okuphumelelayo kudinga ukunakwa okucophelelayo emininingwaneni:

• Ukwenza Ngokwezifiso: Izingxenye kumele zakhiwe ngokunembile ngokwezidingo ezihlukile zekhasimende, ngokuvamile kufaka phakathi ukuhlanganiswa kwezinto ezingezona i-granite njengemigqa yokupholisa kanye nezikhonkwane zenzwa ngqo esakhiweni.

• Ukuqinisekiswa Kwekhwalithi: Ingxenye ngayinye idinga ukulawulwa kwekhwalithi okuqinile, okuhlanganisa ukuba yisicaba, ukunemba, kanye nokuqinisekiswa kwesikwele kusetshenziswa ama-CMM kanye nama-interferometer e-laser, ukuqinisekisa ukuthi ahlangabezana nezindinganiso eziqinile ze-ISO kanye nezamazwe ngamazwe ze-metrology kanye nokunemba.

• Ubambiswano Lwabahlinzeki: Ukukhetha umhlinzeki wezingxenye ze-granite ze-OEM kubambiswano. Kudinga ukuqonda okujulile kokusetshenziswa kwe-semiconductor, ikhono lokukhetha itshe eliluhlaza elisezingeni eliphezulu, kanye nekhono lokukhiqiza lomshini nokuhlanganisa izakhiwo eziyinkimbinkimbi ukuze kuhambisane nokubekezelelana kwe-nanometer.

Ekuphetheni, nakuba i-microchip eqediwe iyisimangaliso sobuhlakani bomuntu, ukudalwa kwayo kuncike ekuzinzeni okuthule okunikezwa yitshe lemvelo. Ukusetshenziswa okuyinkimbinkimbi kwe-granite njengento eyinhloko yombhede womshini we-granite nezinye izingxenye ze-granite ze-OEM ezikhethekile kuyisici esibalulekile ekusunduzeni imingcele ye-miniaturization. Kubakhiqizi be-Wafer Processing Equipment, ukubambisana nochwepheshe ezakhiweni ze-granite ezinembayo kakhulu kuyisinyathelo sokuqala nesiyisisekelo sokuthola umkhawulo wokuncintisana emakethe ye-semiconductor yomhlaba wonke.