Kusixhumanisi esiyinhloko sokwenziwa kwe-chip - ukuskena kwe-wafer, ukunemba kwemishini kunquma ikhwalithi ye-chip. Njengengxenye ebalulekile yemishini, inkinga yokwanda okushisayo kwesisekelo somshini we-granite idonse ukunaka okukhulu.
I-coefficient yokunwetshwa okushisayo kwegwadle ngokuvamile iphakathi kuka-4 no-8×10⁻⁶/℃, ephansi kakhulu kunaleyo yezinsimbi nemabula. Lokhu kusho ukuthi lapho izinga lokushisa lishintsha, ubukhulu bayo bushintsha kancane uma kuqhathaniswa. Kodwa-ke, kufanele kuqashelwe ukuthi ukwanda kwe-thermal ephansi akusho ukuthi akukho ukwanda okushisayo. Ngaphansi kokuguquguquka okukhulu kwezinga lokushisa, ngisho nokunwetshwa okuncane kungase kuthinte ukunemba kwe-nanoscale kokuskena kwe-wafer.
Phakathi nenqubo yokuskena i-wafer, kunezizathu eziningi zokuvela kokunwetshwa kwe-thermal. Ukushintshashintsha kwezinga lokushisa endaweni yokusebenzela, ukushisa okukhiqizwa ukusebenza kwezingxenye zemishini, kanye nezinga lokushisa eliphakeme ngokushesha elethwa ukucutshungulwa kwe-laser kuzodala isisekelo segwadle ukuthi "sinwebe futhi sinciphe ngenxa yokushintsha kwezinga lokushisa". Uma isisekelo sithola ukunwetshwa okushisayo, ukuqondisa kwesitimela esiqondisayo kanye nokucaba kweplathifomu kungase kuphambuke, okubangele umzila wokunyakaza ongalungile wetafula le-wafer. Izingxenye ze-optical ezisekelayo nazo zizogudluka, okubangele ukuba i-beam yokuskena "ichezuke". Ukusebenza ngokuqhubekayo isikhathi eside nakho kuzoqongelela amaphutha, okwenza ukunemba kube kubi nakakhulu.
Kodwa ungakhathazeki. Abantu sebenazo kakade izixazululo. Ngokuphathelene nezinto zokwakha, imithambo ye-granite ene-coefficient ephansi yokwanda okushisayo izokhethwa futhi ibhekane nokwelashwa kokuguga. Mayelana nokulawulwa kwezinga lokushisa, izinga lokushisa leshabhu lilawulwa ngokunembile ku-23±0.5℃ noma ngisho ngaphansi, futhi idivayisi esebenzayo yokukhipha ukushisa nayo izoklanywa isisekelo. Ngokuphathelene nokuklama kwesakhiwo, izakhiwo ezilinganayo kanye nezisekelo eziguquguqukayo ziyamukelwa, futhi ukuqapha kwesikhathi sangempela kwenziwa ngezinzwa zokushisa. Amaphutha abangelwa ukuwohloka kwe-thermal alungiswa ngamandla ngama-algorithms.
Izisetshenziswa ezisezingeni eliphezulu njengemishini ye-ASML lithography, ngalezi zindlela, igcina umphumela wokunwebeka oshisayo wesisekelo se-granite ngaphakathi kwebanga elincane kakhulu, okuvumela ukunemba kokuskena kwe-wafer ukuze kufinyelele izinga le-nanometer. Ngakho-ke, inqobo nje uma ilawulwa kahle, isisekelo se-granite sihlala siyisinqumo esithembekile semishini yokuskena eyi-wafer.
Isikhathi sokuthumela: Jun-12-2025