Ingabe isisekelo somshini we-granite sizokhula ngenxa yokushisa ngesikhathi sokuskena kwe-wafer?

Esihlokweni esiyinhloko sokukhiqiza ama-chip - ukuskena kwe-wafer, ukunemba kwemishini kunquma ikhwalithi ye-chip. Njengengxenye ebalulekile yemishini, inkinga yokwanda kokushisa kwesisekelo somshini we-granite idonsele ukunaka okukhulu.

I-coefficient yokwanda kokushisa kwe-granite ivame ukuba phakathi kuka-4 no-8×10⁻⁶/℃, okuphansi kakhulu kuneyezinsimbi nemabula. Lokhu kusho ukuthi lapho izinga lokushisa lishintsha, usayizi walo ushintsha kancane kakhulu. Kodwa-ke, kufanele kuqashelwe ukuthi ukwanda kokushisa okuphansi akusho ukuthi akukho ukwanda kokushisa. Ngaphansi kokushintshashintsha okukhulu kokushisa, ngisho nokwanda okuncane kakhulu kungathinta ukunemba kwe-nanoscale kokuskena kwe-wafer.

Ngesikhathi senqubo yokuskena i-wafer, kunezizathu eziningi zokuthi kwenzeke ukwanda kokushisa. Ukushintshashintsha kwezinga lokushisa endaweni yokusebenzela, ukushisa okubangelwa ukusebenza kwezingxenye zemishini, kanye nokushisa okuphezulu okusheshayo okulethwa ukucutshungulwa kwe-laser konke kuzokwenza ukuthi isisekelo se-granite "sande futhi sinciphe ngenxa yokushintsha kwezinga lokushisa". Uma isisekelo sidlula ekukhuleni kokushisa, ukuqondile kwesitimela sokuqondisa kanye nokuba yisicaba kwepulatifomu kungase kuphambuke, okuholela endleleni yokunyakaza engafanele yetafula le-wafer. Izingxenye ezisekelayo ze-optical nazo zizoshintsha, okubangela ukuthi umsebe wokuskena "uphambuke". Ukusebenza ngokuqhubekayo isikhathi eside nakho kuzoqoqa amaphutha, okwenza ukunemba kube kubi kakhulu.

Kodwa ungakhathazeki. Abantu sebevele banezixazululo. Ngokuphathelene nezinto zokwakha, imithambo ye-granite ene-coefficient ephansi yokwanda kokushisa izokhethwa futhi iphathwe ukuguga. Ngokuphathelene nokulawula izinga lokushisa, izinga lokushisa le-workshop lilawulwa ngokunembile ku-23±0.5℃ noma ngaphansi, futhi idivayisi esebenzayo yokushabalalisa ukushisa nayo izoklanywa isisekelo. Ngokuphathelene nomklamo wesakhiwo, izakhiwo ezilinganayo kanye nezisekeli eziguquguqukayo ziyasetshenziswa, futhi ukuqapha kwesikhathi sangempela kwenziwa ngezinzwa zokushisa. Amaphutha abangelwa ukuguqulwa kokushisa alungiswa ngokuguquguqukayo ngama-algorithms.

Imishini ephezulu njengemishini ye-lithography ye-ASML, ngalezi zindlela, igcina umphumela wokukhula kokushisa kwesisekelo se-granite ngaphakathi kobubanzi obuncane kakhulu, okwenza ukunemba kokuskena kwe-wafer kufinyelele ezingeni le-nanometer. Ngakho-ke, uma nje ilawulwa kahle, isisekelo se-granite sihlala siyindlela ethembekile yemishini yokuskena ye-wafer.