Njengamanje, ngokuthuthuka okunamandla kwemboni ye-LED, ukusebenza kwemishini ye-LED die bonding kudlala indima ebalulekile kwikhwalithi yomkhiqizo. Izingxenye zegwadle ze-ZHHIMG, ngezinzuzo zazo eziyingqayizivele, seziyingxenye ebalulekile yemishini ye-LED die bonding.
Zinzisa isisekelo ukuze uqinisekise ukunemba kwe-die bonding
Inqubo ye-die bonding yamaledi idinga ukubekwa okunembile kwama-chips amancane ku-substrate. Noma yikuphi ukugudluka okuncane noma ukudlidliza kungase kubangele ukuchezuka kwebhondi efile, kuthinte ukusebenza komkhiqizo. Izingxenye zegwadle ze-ZHHIMG zine-coefficient ephansi kakhulu yokunwetshwa kokushisa. Ngaphansi kokuhlukahluka kwezinga lokushisa okubangelwa ukusebenza kwemishini, izinguquko zabo zobukhulu azinakwa. Lokhu kuvumela okokusebenza kwe-die bonding ukuthi kugcine ukwakheka okuzinzile kukho konke ukusebenza kwesikhathi eside, kunikeze ireferensi yokuma enembile yemisebenzi ye-die bonding. Khonamanjalo, ukuqina okuphezulu nokusebenza okuhle kakhulu kwe-anti-vibration kwezingxenye zegwadle ze-ZHHIMG kungakwazi ukumunca kahle futhi kuvimbele ukudlidliza kwangaphandle kanye nalokho okuvezwa ukusebenza kwemishini ngokwayo, iqinisekise ukubekwa okunembile kwama-chips ngesikhathi senqubo yokuhlanganisa ukufa futhi kuthuthukisa ngokuphawulekayo ukunemba nokuvumelana kwe-die bonding.
Ukukhetha okuhlala isikhathi eside, ukunciphisa izindleko zokunakekela
Imishini ye-LED die bonding idinga ukusebenza ngokuqhubekayo isikhathi eside, futhi izidingo zokuqina zezingxenye zemishini ziphezulu kakhulu. Izingxenye ze-granite ze-ZHHIMG zinokuqina okuphezulu nokumelana nokugqoka okuqinile. Ngesikhathi sokunyakaza okujwayelekile kwemishini kanye nokungqubuzana kwemishini yokubopha ifa, bangagcina izakhiwo ezinhle zomzimba futhi abathambekele ekugugekeni nasekuguqukeni. Isakhiwo sayo sangaphakathi siminyene futhi siyafana, sinokuzinza okuhle kakhulu kwamakhemikhali. Ingakwazi ukumelana nokuguguleka kwezinto ezihlukahlukene zamakhemikhali futhi igcine ukusebenza okuzinzile isikhathi eside ngisho nasezindaweni eziyinkimbinkimbi zokukhiqiza. Lokhu kwandisa kakhulu impilo yesevisi yezingxenye ze-granite ze-ZHHIMG, kunciphisa imvamisa yokugcinwa kwemishini nokushintshwa, futhi kwehlisa izindleko zokusebenza zamabhizinisi.
Ukuzijwayeza nokuthuthukisa kusiza ukuthuthukiswa kwezimboni
Ngokuthuthukiswa kobuchwepheshe be-LED maqondana ne-Mini LED kanye ne-Micro LED, kuye kwabekwa izidingo eziphakeme zokunemba nokuzinza kwemishini ye-die bonding. Izingxenye ze-granite ze-ZHHIMG, ngokusebenza kwazo okuvelele, zingahlangabezana kahle nezidingo zokuthuthukiswa kobuchwepheshe bemboni ye-LED. Ubuchwepheshe bayo bokucubungula obunembayo bungenza ngokwezifiso izingxenye ezihlangabezana nezidingo zemishini ehlukene ye-die bonding. Kungakhathaliseki ukuthi ngokuya ngokucaba, ukuqondile noma ukuhwaqazeka kwendawo, ingafinyelela izindinganiso eziphakeme kakhulu, inikeze isisekelo esiqinile sobuchwepheshe obuthuthukisiwe be-die bonding.
Izingxenye zegwadle ze-ZHHIMG zidlala indima ebalulekile emishinini yokubopha i-LED die ngenxa yokuzinza kwazo okuvelele, ukuqina kanye nokuvumelana nezimo. Akugcini nje ngokuthuthukisa ikhwalithi ye-die bonding kanye nokusebenza kahle kokukhiqizwa kwemikhiqizo ye-LED, kodwa futhi inikeza isiqinisekiso esiqinile sokuthuthukiswa okusimeme kwemboni ye-LED. Kuyisinqumo esihle semishini ye-LED die bonding.
Isikhathi sokuthumela: May-22-2025