Uma usembonini ye-semiconductor, i-PCB drilling, noma imboni ye-laser ye-femtosecond, usuvele usazi isitha: ukudlidliza.
Ukudlidliza okuncane ohlelweni lwe-CMM (Coordinate Measuring Machine) noma i-AOI (Automated Optical Inspection) akugcini nje ngokubangela ukufundwa okubi; kubangele ukwehluleka kwe-batch. Izisekelo zensimbi ezijwayelekile zivame ukuhlushwa ukwanda kokushisa kanye nokudlidliza okuncane.
Yingakho i-ZHHIMG®Izingxenye zeGranitesekuyindinganiso yemboni yezinkampani ezifana ne-Samsung, i-GE, ne-Bosch. I-granite yethu emnyama ye-ZHHIMG® ine-coefficient ephansi kakhulu yokwanda okuqondile. Ngisho noma izinga lokushisa le-workshop lishintshashintsha ngo-±5℃, ukuguqulwa kungu-0.0005mm/m kuphela.
Kungakhathaliseki ukuthi umbhede omkhulu we-granite wamamitha angu-20 we-umsiki we-laser onembilenoma i-air bearing encane yetafula le-XY, i-granite yethu isebenza njenge-dampener ephelele. Sicubungule amasethi angaphezu kuka-20,000 emibhede enembile njalo ngenyanga, futhi ozakwethu bayasithemba ngoba siyaqonda ukuthi zibuhlungu kangakanani.
Ibhizinisi elinembile alikwazi ukuba nzima kakhulu. Uma isisekelo semishini yakho singazinzile ngokuphelele, umshini wakho wezigidi zamaRandi empeleni uyaqagela.
Isikhathi sokuthunyelwe: Juni-23-2026